Smart soft good product, circuitry layer, and methods

ABSTRACT

One variation of a method for fabricating a garment includes: applying a first mask to a first side of a fabric substrate coated with a conductive material; applying a second mask—mirrored image of the first mask—to a second side of the fabric substrate opposite the first side; applying an etchant to the fabric substrate to remove conductive material outside of the first mask; arranging a conductive interface pad of a component carrier over an electrode defined by remaining conductive material on the fabric substrate, the component carrier including a flexible substrate and a rigid electrical component mounted to the flexible substrate, the conductive interface pad extending from a terminal of the rigid electrical component across a region of the flexible substrate; mechanically fastening the component carrier to the fabric substrate to form a garment insert including an electrical circuit; and incorporating the garment insert into the garment.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No.62/232,217, filed on 24 Sep. 2015, U.S. Provisional Application No.62/253,826, filed on 11-Nov.-2015, U.S. Provisional Application No.62/263,456, filed on 4-Dec.-2015, and U.S. Provisional Application No.62/338,251, filed on 18-May-2016, all of which are incorporated in theirentireties by this reference.

TECHNICAL FIELD

This invention relates generally to the field of garment manufacturingand more specifically to a new and useful system for heating a garmentin the field of garment manufacturing.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a flowchart representation of a system;

FIG. 2 is a flowchart representation of one variation of the system;

FIGS. 3A and 3B are schematic representations of one variation of thesystem; and

FIG. 4 is a schematic representation of one variation of the system.

FIG. 5 is a schematic representation of a conductive ink;

FIG. 6 is a schematic representation of an ink deposition system;

FIG. 7 is a flowchart representation of a first method;

FIG. 8 is a flowchart representation of a second method;

FIG. 9 is a flowchart representation of a garment; and

FIGS. 10A and 10B are flowchart representation of a garment insert.

DESCRIPTION OF THE EMBODIMENTS

The following description of embodiments of the invention is notintended to limit the invention to these embodiments but rather toenable a person skilled in the art to make and use this invention.Variations, configurations, implementations, example implementations,and examples described herein are optional and are not exclusive to thevariations, configurations, implementations, example implementations,and examples they describe. The invention described herein can includeany and all permutations of these variations, configurations,implementations, example implementations, and examples.

1. System

As shown in FIG. 1, a heated garment (hereinafter the system 100includes: a garment 110 including an exterior fabric section 112 and alining 114; a heating element 120 arranged over a first region 121 ofthe lining 114 and including an elongated woven textile, the elongatedwoven textile doped with conductive particulate 173 at a first end andat a second end; a metallic connector 130 arranged over the first end ofthe elongated woven textile and including a conductive lead 132extending toward a power junction 140 in a second region 122 of thelining 114; and a power module 150 configured to transiently mount tothe second region 122 of the lining 114, to transiently engage the powerjunction 140, and to intermittently supply current to the heatingelement 120 via the conductive lead 132 and the metallic connector 130.

One variation of the system 100 defines a kit including: a garmentinsert 160 configured for installation between an exterior fabricsection 112 and an interior lining 114 of a garment; a heating element120 mounted to a first region 121 of the garment insert 160 andincluding an elongated woven textile, the elongated woven textile dopedwith conductive particulate 173 at a first end and at a second end andcharacterized by a first impedance along a central axis from the firstend to the second end; a metallic connector 130 crimped over the firstend of the elongated woven textile and including a conductive lead 132sewn onto the garment insert 160; a power junction 140 arranged over asecond region 122 of the lining 114 and electrically coupled to theconductive lead 132; and a power module 150 configured to transientlycoupled to the second region 122 of the garment insert 160, totransiently engage the power junction 140, and to intermittently supplycurrent to the heating element 120 via the conductive lead 132 and themetallic conductor.

1.1 Applications

Generally, the system 100 is configured for integration or installationwithin a garment—such as a jacket, a dress, pants, or a blouse—tointermittently warm a user wearing the garment 110. The system 100includes a power module 150 and a garment insert 160 and one or moreheating elements, an input control 152, a temperature sensor 180, and/orconnectors between various elements arranged on (e.g., sewn into) thegarment insert 160. With the garment insert 160 installed or integratedinto a garment, the power module 150 can be electrically coupled to thegarment insert 160 to supply current to the heating elements.

The system 100 includes textile-based heating elements and flexibleelectronic connections and is configured for integration or installationinto garments with standard textile production equipment and withsubstantially minimal (or no) electronics manufacturing equipment orprocesses. In particular, the system 100 can include textiles andclothing-type interfaces and controls that output heat, sense ambientconditions, and capture user inputs to set one or more operatingparameters. Furthermore, elements within the system 100 can be assembledinto a garment according to processes and materials standard or commonin the textile and garment industries in order to preserve a feeling ofclothing and fashion in the garment no rather than a feeling oftechnology.

1.2 Configurations

In a first configuration, the system 100 defines a complete subsystemready for installation inside an exterior fabric section 112 of agarment, as shown in FIG. 1. For example, in this configuration: alining 114 (e.g., a garment insert 160) of muslin can be cut to matchthe perimeter geometry of a center-back panel of a dress and a firstbutton slit and a second button slit can be cut and sewn into the lowercenter of the lining 114; one heating element can be sewn directly ontothe lining 114 with a running stitch at each of a left flank region, aright flank region, and a center collar region of the lining 114; andthe heating elements can be connected in parallel to the first andsecond button slits via insulated wires and connectors sewn onto thelining 114. The complete lining and a power module 150—including buttonsconfigured for installation into the button slits to communicate (e.g.,conduct) current into the heating element 120 via the insulated wiresand connectors—can then be supplied to a seamstress, and the seamstresscan stitch the lining 114 behind a center-back panel of a dress duringmanufacture of the dress.

In another configuration, the system 100 includes a wired subsystemready for arrangement on a lining or fabric section of a garment. Forexample, in this configuration: a pair of connectors and a conductivelead 132 can be sewn onto a non-conductive fabric carrier (e.g., a stripof muslin); the end of a heating element can be sewn, clamped, oradhered, etc. onto a connector on the fabric carrier; and a powerjunction 140 can be mounted on and electrically coupled to theconductive lead 132 on the fabric carrier. The fabric carrier-heatingelement assembly and a power module 150 can then be supplied to alow-volume garment manufacturer, and the garment 110 manufacturer canfold the fabric carrier-heating element into a desired profile andstitch the fabric carrier-heating element onto a lining or other fabricsection of a jacket during manufacture of the jacket.

In yet another configuration, the system 100 is supplied to ahigh-volume garment manufacturer as a group of discrete heatingelements, connectors, an input control 152, a power junction 140, and apower supply per garment unit. In this configuration, the garment 110manufacture: stitches or bonds (e.g., with a flexible adhesive) theheating elements to a lining or other fabric section of a garment;rivets the power junction 140 onto the lining 114; stitches the inputcontrol 152 onto the lining 114; installs the metallic connectorsbetween the heating elements, power junction 140, and input control 152;assembles the lining 114 and fabric sections to complete the garment110; and supplies the garment 110 and the power supply to a retailer.

1.3 Heating Element

The system 100 includes a heating element including an elongated woventextile doped with conductive particulate 173 at a first end and at asecond end and characterized by a first impedance along a central axisfrom the first end to the second end. Generally, the heating element 120defines a flexible (e.g., fabric-like) resistance heating elementconfigured to generate heat due to Joule heating as electric current iscommunicated from the power module 150 through the heating element 120.

In one implementation, the heating element 120 includes a woven carbonfiber panel, such as an elongated rectilinear strip of unidirectional or2×2 twill weave of carbon fibers. In this implementation, the carbonfiber panel can define a first end and a second end that are transientlyconnected to corresponding terminals of a current source (e.g., abattery arranged within the power module 150), as described below. Thecarbon fiber panel can also include multiple, unbroken carbon fibersthat extend from the first end to the second end of the heating element120. The carbon fiber panel can therefore exhibit relatively highconductivity (i.e., low resistance) along the carbon fibers—that is,between the first end and the second end along an X-axis parallel to thecontinuous length of the fibers extending therebetween. However, thecarbon fibers can exhibit relatively low off-axis conductivity such thatthe carbon fiber panel exhibits relatively high resistance along itsY-axis and Z-axis.

In the foregoing implementation, the carbon fiber panel can be dopedwith conductive particles to achieve a first impedance between the firstend and the second end that is substantially identical (i.e., “matched”)to the a second impedance of the current source in order to generatemaximum heat wattage output of the heating element 120. For example, theheating element 120 can be impregnated with silver nanoparticles, suchas by introducing silver nanoparticles suspended in a low-viscosityfluid to the carbon fiber panel within a vacuum environment, and silvernanoparticles can then be sealed within the heating element 120 byencasing both sides of the heating element 120 with an elastic polymer(e.g., latex). In another example, silver nanoparticles can be suspendedin a solvent that is painted on one or both sides of the heating element120; once (or as) the solvent evaporates, the heating element 120 can bepainted, dipped, or sprayed with an elastic polymer to seal the silvernanoparticles within the heating element 120.

In the foregoing implementation, a target depth, concentration,thickness, and/or particulate size of conductive particles can beapplied over or impregnated into the heating element 120 to achieve atarget aggregate impedance between the first end and the second end ofthe heating element 120. For example, for a battery with an internalimpedance between 38 and 40 milliohms and for a first heating element 2″wide, 10″ long, and including a single woven layer of carbon fiberthreads 0.060″ thick, the full area of both broad sides of the heatingelement 120 can be impregnated with silver nanoparticles to a depth of0.004″ to achieve a target impedance of approximately 39 milliohmsbetween the first and second ends of the heating element 120. In anotherexample, for the same battery and for a second heating element 1″ wide,10″ long, and including a single woven layer of carbon fiber threads0.060″ thick, the full area of both broad sides of the heating element120 can be impregnated with silver nanoparticles to a depth of 0.004″ toagain achieve a target impedance of approximately 39 milliohms betweenthe first and second ends of the heating element 120.

In the foregoing implementation, select regions of the heating element120 can also be masked and conductive particles can be applied orimpregnated into sections of the heating element 120 between maskedregions to similarly achieve a target impedance between the first andsecond ends of the heating element 120. For example, conductive dopantcan be applied or impregnated in discrete, parallel rows extending fromthe first end to the second end of the carbon fiber panel. The heatingelement 120 can also include multiple similar woven layers of carbonfibers that cooperate to achieve a lower total impedance between thefirst and second ends of the heating element 120.

Alternatively, the heating element 120 can include conductive threads(e.g., nylon thread impregnated with silver nanoparticles) woven orstitched through a non-conductive textile (e.g., muslin) backing.However, the heating element 120 can include a panel or sheet of anyother conductive textile or flexible, conductive material. The heatingelement 120 can also be doped (e.g., impregnated, coated) with any otherconductive material according to any other depth, thickness,concentration, or other parameters to achieve a target impedance (ortarget impedance range) across the heating element 120.

In one implementation, the first end of the heating element 120 isselectively doped (or doped to a greater depth, thickness, and/orconcentration) with conductive material to achieve improved Z-axisconductivity at the first end. In particular, conductive particlescoated or impregnated into the first end of the heating element 120 canconduct current from an adjacent connector (described below), along theZ-axis of the heating element 120, into adjacent carbon fibers; carbonfibers extending continuously from the first end to the second end canthus communicate current from the doped first end to the second end ofthe heating element 120.

In the foregoing implementation, conductive material impregnatedpartially or fully through the Z-height of the first end of the heatingelement 120 can form a conductive interface between an adjacentconnector and longitudinal carbon fibers within the heating element 120to achieve lower Z-axis resistance locally at the first end of theheating element 120. As described above, the first end of the heatingelement 120 can be coated or impregnated with conductive nanoparticlesin a suspension of a curable or volatile material, such as silvernanoparticles suspended in a photo-curable resin or silver nanoparticlesmixed into a drying adhesive (e.g., silver nanoparticles mixed withinsolid rubber particles dissolved in a volatile solvent). The second endof a heating element can be similarly doped with conductive material toimprove Z-axis conductivity between an adjacent and connected carbonfibers extending into the second end of the heating element 120.

However, the heating element 120 can include conductive fibers, threads,wires, strings, or yarns, etc. woven in any other pattern into aflexible textile or textile-like panel of any other suitable geometry.Select regions of the heating element 120 can also be doped with anyother conductive material in any other suitable way to achieve a targetX-axis impedance between the first and second ends of the heatingelement 120 and to achieve at least a threshold Z-axis conductivityadjacent one or more connectors. The system 100 can also includemultiple substantially similar or dissimilar heating elements.

Furthermore, the system can include other electrical componentsfabricated via similar methods and techniques directly onto a textilesubstrate. For example, the system can include a resistor, capacitor, orinductor fabricated onto the textile substrate by depositing conductivematerial onto the textile substrate, as described above.

1.4 Connectors

The system 100 includes a set of metallic connectors 130 configured toconnect the first and second ends of the heating element 120 to othercomponents within the system 100, such as to ends of other heatingelements or to the power junction 140. Generally, the metallic connector130 defines an electrode configured to abut a conductive surface of thefirst (or second) end of the heating element 120 and to form a Z-axiselectrical connection with the heating element 120. For example, themetallic connector 130 includes an electrically-conductive (e.g.,metallic, copper) electrode connected to a conductive lead 132 (e.g., aninsulated wire) and configured to mate with an end of the heatingelement 120 in order to communicate current into (or out of) the heatingelement 120. In this example, the metallic connector 130 can include twocopper electrodes connected by (e.g., soldered to) a braided copperwire, and the metallic connector 130 can be installed in series betweentwo heating elements. The metallic connector 130 can also exhibit atotal X-axis impedance that differs substantially from (i.e., issubstantially greater than or substantially less than) the internalimpedance of the battery in the power module 150 in order to limit Jouleheating across the metallic connector 130.

In the configuration in which the system 100 is supplied assembled, themetallic connector 130 can include an electrode bonded over a doped end(e.g., the first end, the second end) of the heating element 120 with aflexible conductive adhesive. Alternatively, the electrode can beriveted to the electrode. Yet alternatively, the electrode can beperforated or can define a substantially thin (e.g., foil) structure andcan be sewn directly onto the end of the heating element 120. In thisconfiguration, once assembled, the metallic connector 130 and the end ofthe heating element 120 can be encased or overmolded with anon-conductive material, such as silicone or latex.

Alternatively, the metallic connector 130 can be crimped over the first(or second) end of the heating element 120. For example, as shown inFIG. 2, the metallic connector 130 can include a folded sheet metalstructure defining in internal V-section configured to receive an end ofthe heating element 120. In this example, once the doped end of theheating element 120 is inserted into the internal V-section of themetallic connector 130, the metallic connector 130 can be compressed(e.g., stamped, punched, or folded) to close the internal V-section,thereby pinching and retaining the end of the heating element 120. Inthis implementation, the metallic connector 130 can include one or moreprongs (e.g., “teeth”) proximal the distal end of one or both sides ofthe internal V-section, and the prongs can pierce the doped end of theheating element 120 to improve Z-axis conductivity between the metallicconnector 130 and the heating element 120. By piercing the heatingelement 120, the prongs can also prevent the metallic connector 130 fromsliding off of the end of the doped end of the heating element 120 iftensioned. For example, the metallic connector 130 can include multipleprongs along the breadth of each distal end of the internal V-section,wherein each tooth is angled toward the throat of the internal V-sectionto enable the doped end of the heating element 120 to be easily insertedinto the metallic connector 130 but to prevent release of the heatingelement 120 when the metallic connector 130 and the heating element 120are tensioned.

In for foregoing implementation, external surfaces of the folded sheetmetal structure can be coated or overmolded within a non-conductivematerial, such as silicone or rubber, and the footprint of each side ofthe folded sheet metal structure can exceed the footprint of theadjacent doped end of the heating element 120 such that the metallicconnector 130 fully covers the doped end of the heating element 120 whenthe heating element 120 and the metallic connector 130 are assembled.

Connectors as described in the foregoing implementation can be suppliedto a garment manufacturer in a kit of components and can be connected toheating elements manually with a crimping tool or mallet or withrelatively simple automated press rather than more complicated tools,tooling, or processes during manufacture of a garment.

However, the metallic connector 130 can be assembled or connected to anend of the heating element 120 in any other suitable way. As describedabove, the metallic connector 130 can also include a conductive lead 132(e.g., a braided copper wire) welded, soldered, or otherwise attached tothe electrode, and the conductive lead 132 can be connected at anopposite end to the power junction 140 or to a second (like) electrode.The metallic connector 130 can thus be arranged between the heatingelement 120 and the power module 150, or the metallic connector 130 canbe arranged between the heating element 120 and a second heating elementwithin the system 100.

1.5 Textile Backing

In one variation, the system 100 includes a textile backing sewn,clamped, or otherwise installed behind and configured to support theheating element 120 and the metallic connector 130. In oneimplementation, the system 100 includes a single textile lining (e.g., amuslin lining) onto which heating elements and connectors are sewn orbonded directly. In this implementation, the textile lining can be sewndirectly into the seams of a garment.

In another implementation, the system 100 includes a single elongatedtextile backing strip of width slightly greater than the width of eachheating element in the system 100. In this implementation, the heatingelements and connectors are sewn or bonded in a linear arrangement alongthe backing strip. When installed in a garment, the backing strip—withheating elements and connectors—can be folded and/or gathered into adesired heater placement pattern for the garment 110, and edges of thebacking strip—which extend beyond the edges of the heating element120—can be sewn across an interior lining of the garment no.

In yet another implementation, the system 100 includes multiple textilebackings, wherein each backing is sewn between ends of a pair ofadjacent heating elements and to the conductive lead 132 of a connectorextending therebetween. A series of heating elements and textile backinginterposed between adjacent heating elements can be sewn, bonded, orassembled in series to form a serial heater assembly. The serial heaterassembly can then be installed in a garment, as described above.

However, the heating elements and/or connectors in the system 100 can bemounted onto one or more textile backings according to any other patternor configuration.

1.6 Power Module

The system 100 includes a power module 150 configured to transientlymount to the garment 110 (e.g., to the second region 122 of the lining114), to transiently engage the power junction 140, and tointermittently supply current to the heating element 120 via themetallic connector 130. Generally, the power module 150 includes abattery, a connector that interfaces with the power junction 140, and ahigh-current switch that intermittently closes a circuit between thebattery and the power junction 140 to supply to the heating element120(s) within the garment 110. For example, the power module 150 caninclude a rechargeable lithium-ion battery, an H-bridge power driver, aprocessor, and a connector (e.g., a plug receptacle) arranged within ahousing. The power module 150 can also include a momentary switch,potentiometer, rheostat, or other input control 152 electrically coupledto the processor, and the processor can activate the power driver,deactivate the power driver, and/or modify a duty cycle of the powerdriver based on an input into the input control 152.

As described below, the power module 150 can be separated from thegarment 110 at the power junction 140 in order to recharge the powermodule 150 and/or to wash or clean the garment 110. For example, thebattery can be recharged through the metallic connector 130.Alternatively, the power module 150 can include an internal inductivecharging circuit that recharges the battery when the power module 150 isplaced on an indicative charging surface.

1.7 Temperature Sensor

In one variation, the system 100 further includes a temperature sensor180 electrically coupled to the processor within the power module 150and configured to output a signal corresponding to a local ambienttemperature. In this variation, the processor within the power module150 can deactivate the power driver when an output of the temperaturesensor 180 indicates that the local ambient temperature exceeds athreshold temperature (e.g., 67° F.), such as a static temperaturethreshold, a dynamic temperature that varied inversely with localhumidity (as determined from a humidity sensor integrated into thegarment 110 or into the power module 150), or a custom temperaturethreshold set by the user. The processor can therefore sample thetemperature sensor 180 during operation and modify the output of thepower module 150 substantially in real-time, such as to cease heatingwithin the garment 110 when the user enters a temperature-controlledbuilding or to increase heating within the garment 110 when the ambienttemperature drops (and rain starts to fall). The processor can alsodynamically modify the duty cycle of the power driver inversely with thelocal ambient temperature detected by the temperature sensor 180 (and/orproportionally with ambient humidity).

In one implementation, the temperature sensor 180 is integrated into thepower module 150. Alternatively, the temperature sensor 180 can bewater-proof (or water-resistant) or arranged within a water-proofhousing and configured or arranged on or within the garment 110. Forexample, the temperature sensor 180 can be integrated into the garment110 remotely from the heating element 120, such as sewn over theexterior fabric section 112 of the garment no, onto the inside of theouter fabric layer of the garment 110, or a textile backing or liningonto which the heating element 120 is mounted. In this example, thetemperature sensor 180 can be arranged near a shoulder of the garment110, near the upper chest of the garment 110, or on a lapel of thegarment no such that the temperature sensor 180 experiences minimalheating by the heating element 120 or the user, thereby yielding anoutput more representative of the ambient temperature. A ground channeland sense leads can also be wired from the temperature sensor 180 to thepower junction 140. For example, the ground and sense leads can be sewnonto the lining 114 supporting the heating element 120 or into a seamwithin the garment 110. When the power module 150 is connected to thepower junction 140, the processor can thus sample the sense channel overtime during operation and modify the output of the power driveraccordingly, as described above.

1.8 Input Controls

As described above, the power module 150 can include an integrated inputcontrol 152—such as a momentary button, a switch, or apotentiometer—that a user can manipulate to adjust a thermal output ofthe system 100. Alternatively, the system 100 can include a discreteinput control 152 configured to integrate into the garment 110 directly(i.e., rather than into the power module 150).

In one implementation, the system 100 includes a zipper potentiometerwired to a power lead and to a sense lead connected to the powerjunction 140 and configured to be sewn onto the exterior fabric section112 of the garment 110. In this implementation, the zipper potentiometerincludes a slider head that rides along two interlocking columns ofconductive (e.g., brass) teeth, wherein a first column is electricallyconnected to the power lead and a second column is connected to thesense lead. The zipper potentiometer can exhibit a resistance across theinterlocking columns as a function of the position of the slider headalong the column. In this implementation, the processor can read theresistance across the zipper potentiometer by applying a voltage to thepower lead and then reading the voltage output at the sense lead. Forexample, for the battery that exhibits a varying voltage under differentload conditions and charge states, the positive terminal of the batterycan be electrically coupled to a first column of the zipperpotentiometer (via the power junction 140) and to the non-invertinginput of a differential op-amp arranged within the power module 150; andthe second column of the zipper potentiometer is electrically coupled tothe inverting side of the differential op-amp. In this example, theprocessor reads the output of the differential op-amp via an internalA/D converter and then supplies power to the heating elements at a rateproportional to the voltage output by the op-amp (e.g., inverselyproportional to the resistance across the zipper potentiometer). Forexample, the processor can adjust the duty cycle of a digital PWM signaloutput to the power driver from 0% to 100% based on the resistanceacross the zipper potentiometer from a maximum resistance to a minimumresistance, respectively.

In the foregoing implementation, the zipper potentiometer can be azipper sewn over a pocket on the garment 110 and can thus function toboth close the pocket and to set the power output of the system 100.Alternatively the zipper potentiometer can be sewn over a continuoustextile region of the garment 110 (i.e., over a region of the garment110 excluding a pocket).

In another implementation, the system 100 includes an input control 152integrated into a clothing button 156 configured for assembly onto thegarment 110, as shown in FIGS. 3A and 3B. For example, the input control152 can include a clothing button 156 including a momentary switch andconfigured to be stitched onto the garment 110 with conductive thread154. For example, in the configuration in which the heating elements areassembled onto a lining (or backing), the lining 114 can include a pairof adjacent regions doped with a conductive material or stitching with aconductive thread 154 extending to the power junction 140, and theclothing button 156 can be mounted onto the garment 110 with twoseparate and discrete conductive threads passing through the exteriorfabric section 112 of the garment 110 and through correspondingconductive regions on the lining 114. Thus, with the garment 110assembled and the power module 150 connected to the power junction 140,the processor can index through multiple power settings—such as off, lowheat, medium heat, and high heat—in response to depression of themomentary switch on the single clothing button 156.

In the foregoing implementations, the power module 150 can also includea haptic feedback module (e.g., a vibrator), and the processor canactuate the haptic feedback module in response to an input on theclothing button 156 or in response to a change in the position of thezipper potentiometer in order to indicate the mode or power settingcurrently executed by the system 100. For example, the processor cantrigger the haptic feedback module to output one short pulse to indicatethat the system 100 is in low heat mode, two short pulses to indicatethat the system 100 is in medium heat mode, three short pulses toindicate that the system 100 is in high heat mode, one long pulse toindicate that the system 100 has turned on, and two long pulses toindicate that the system 100 has turned off.

Alternatively, one or more input controls can be integrated directlyinto the power module 150, such as in the form of a momentary switch ora rheostat, as described above. However, the system 100 can include anyother type of input control 152 or combination of inputs controls of thesame of different types. For example, the system 100 can include aclothing button 156-type input control 152 to turn the processor ON andOFF and a zipper potentiometer to set the output power of the system 100when ON.

1.9 Power Junction

The power junction 140 functions to transiently connect analog powerand/or logic-level digital channels in the power module 150 tocorresponding channels (e.g., heating elements, sensors) in the garment110. In one example, the power junction 140 is mounted to the garmentinsert 160 or backing within or near a side or breast pocket in thegarment 110 in order to hide the power module 150 within the garment 110and in order to enable a user to relatively easily install and removethe power module 150 from the power junction 140. However, the powerjunction 140 can be arranged on the lining 114 or within the garment 110in any other suitable position.

1.9.1 Plug and Receptacle

In one implementation, the power junction 140 includes a femalereceptacle electrically connected to the heating element 120, the inputcontrols, etc. and configured to engage a corresponding male plug on thepower module 150, as shown in FIG. 1. For example, for the configurationdescribed above in which the input controls and the temperature sensor180 are arranged in the power module 150, the power junction 140 caninclude a two-channel ⅛″ headphone jack including a power channel and aground channel. In another example, in which the input control 152 (orthe temperature sensor 180) is arranged in the garment 110, the powerjunction 140 can include a four-channel jack including: avoltage-variable power channel; a common ground channel; a low-currentconstant voltage supply channel; and a digital or analog input channelfrom the input control 152. In this implementation, the power junction140 can include additional channels, such as for a remote temperaturesensor 180, additional input controls (e.g., a second button), etc.arranged in or on the garment no.

In the foregoing implementation, the power junction 140 can be mounteddirectly to the garment no, such as to the garment insert 160, via astitch, a rivet, an adhesive, or any other fastener. Alternatively, thepower junction 140 can be attached to a cable extending from the garmentno.

Furthermore, in this implementation, the power module 150 can include amale plug configured to transiently (i.e., removably) engage the femalereceptacle. For example, the power module 150 can be removed from thepower junction 140 when the garment 110 is laundered. The power junction140 can also include a polymer sleeve that seals over the femalereceptacle when the male plug is removed from the female receptacle butthat deforms around the male plug when the male plug is inserted intothe female receptacle. For example, the power junction 140 can include apolymer sleeve defining a slit over the open end of the femalereceptacle, and the user can pinch the polymer sleeve to open the slitand then insert the male plug on the power module 150 into the femalereceptacle. In another example, the male plug (or female receptacle) caninclude a ferrous material, and the female receptacle (or male plug) caninclude a magnetic element configured to transiently mate with andretain the male plug (or vice versa). In this example, the magneticfemale receptacle can be sewn directly into the garment and caninterface with the male plug extending from the power module 150 whenthe garment no is in use.

1.9.2 Snap Buttons

In another implementation, the system 100 includes a set of conductive(e.g., metal) snaps that transiently couple the power module 150 to thegarment 110 and communicate power and/or logic-level electrical signalsbetween the power module 150 and heating elements, sensors, and/or inputcontrols, etc. in the garment 110. In this implementation, the system100 can include one snap button per I/O channel in the garment 110, suchas one snap button each of: a high-current power supply channel forpowering the heating elements; a common ground channel; low-currentvoltage supply channel for supplying power to a temperature sensor 180and to a momentary switch; a first digital I/O channel for sensingoutputs of the temperature sensor 180; and a first digital I/O channelfor sensing outputs of the momentary switch.

In one implementation, each snap includes one male snap button endextending from the power module 150 and one female snap button endmounted on (e.g., riveted to) the garment 110 (or vice versa) per snap.The male snap button ends can be: riveted, soldered, or otherwisemounted directly to a PCB within the power module 150; mountedexternally on the power module 150 housing and wired to an internal PCB;or otherwise electrically coupled to power and logic level I/O channelswithin the power module 150. The female snap button ends can be rivetedthrough the interior lining, garment insert 160, and/or exterior fabricsection 112 in the garment 110 with metallic (or otherwise electricallyconductive) rivets. A female snap button end can also be riveteddirectly through a heating element, such as through a metal foil wrappedaround a doped end of the heating element 120. Alternatively, the femalesnap button ends can be riveted through a metallic connector, asdescribed above, including leads configured to extend to and toelectrically couple to a heating element, an input control 152, and/or asensor, etc. sewn into the garment 110. Yet alternatively, the garment110 can include conductive thread sewn into select regions of thegarment insert 160 and extending to one or more heating elements, inputcontrols, and/or sensors, and the female snap button ends can be rivetedwith conductive rivets, sewn with conductive thread, or otherwisemounted to the garment insert 160 over these select conductive regions.Similarly, the garment insert 160 can include select regions doped withconductive material, as described above, and each female button snap endcan be mounted over and electrically coupled to one of the selectconductive regions, which can then be coupled to one of a heatingelement, a sensor, or a ground plane within the garment no via aconnector as described above.

In one example, the garment no includes a set of five female snap buttonends arranged in a vertical column along the spine of the garment noadjacent and below the collar of the garment no and facing the interiorof the garment no. In this example, the power module 150 includes a setof five male snap button ends arranged in a column in a substantiallysimilar pattern. To enable heating, sensing, and control functions inthe garment no, the user can install the power module 150 into thegarment no by snapping the male snap button ends on the power module 150into corresponding female snap button ends in the garment no. The snapbuttons can thus communication power and logic-level signals between thegarment 110 and the power module 150. Furthermore, in this example, thepower module 150: is arranged between the user and the garment no and istherefore not immediately visible; is supported near the user'sshoulders, which may mitigate back strain from the additional weight ofthe power module 150; and is centered on the user's back, which maylimit the power module 150's effect on how the garment 110 drapes overthe user; and is supported relatively high on the user's back, which mayenable the user to sit in a chair while wearing the garment 110 withoutthe discomfort of sitting against the power module 150. However, thepower module 150 can be mounted in any other position or location ongarment, such as over a shoulder blade, in a side or breast pocket, etc.

For configurations of the garment no in which the power module 150interfaces with elements within the garment no over three or morechannels, the garment 110 can include a set of female snap button endsarranged in a linear or grid pattern with center-to-center distancesbetween adjacent snap buttons varying across the set—and the powermodule 150 can include a set of male snap buttons arranged in a similar,mirrored pattern—such that the power module 150 can only be mounted tothe garment no in one orientation.

1.9.3 Clothing Buttons

In a similar implementation, the power module 150 can include a set ofclothing buttons 156 mounted or fixed to a surface of the power module150, and the garment no can include a series of slits 158, eachconfigured to receive one clothing button 156 on the power module 150,as shown in FIG. 4. In this implementation, the power module 150 caninclude one discrete conductive trace behind each clothing button 156,and the garment no can include a conductive trace or conductive element(e.g., conductive thread) extending up to or around each slit 158. Thepower module 150 can therefore be installed on the garment 110 byinserting the clothing buttons 156 into the slits 158 in the garment no,and the conductive traces on the power module 150 can thus contactcorresponding conductive elements on the garment no. Furthermore, inthis implementation, the clothing buttons 156 on the power module 150can be sprung toward their adjacent conductive traces. In particular, aparticular clothing button 156 can be sprung toward the power module 150such that, when inserted into a corresponding slit 158 in the garment110, the particular button compresses adjacent garmentmaterial—including the adjacent conductive element—toward thecorresponding conductive trace on the power module 150 to ensureconsistent contact therebetween.

In this implementation, the buttons on the power module 150 and thecorresponding slits 158 in the garment 110 can be arranged and can becoupled to elements within the garment 110 as in the foregoingimplementation. Furthermore, in the foregoing implementations, the powermodule 150 can therefore be connected to the garment 110 viagarment-type fasteners rather than common electronic type connectors.However, the power module 150 can be transiently (i.e., removably)installed on or within the garment 110 in any other way and in any otherconfiguration or position, and channels within the power module 150 canbe transiently electrically coupled to channels within the garment 110in any other suitable way. The system 100 described above can also bemirrored or combined, such as by including female snap button ends onthe power module 150 and a male snap button end on the garment 110, bothmale and female snap button ends on the power module 150 and the garmentno, or both snap buttons and clothing button 156-slit pairs on the powermodule 150 and garment.

1.9.4 Interface Protocols

In the foregoing implementations, when the power module 150 is connectedto the garment no, the power module 150 can test each channel in thegarment 110 with logic-level voltage and current signals in order toidentify power supply limitations for each channel before supplyinghigher-voltage or higher-current signals to the garment 110. Forexample, on startup (e.g., when first (re)installed in the garment 110or powered on by the user), the power module 150 can: lock a groundchannel to ground; test the resistance of each other channel through toground; access a lookup specifying resistance ranges acceptable for eachchannel (e.g., a resistance value matched to the battery .+−.10% for theheating elements, infinite resistance for the momentary switch, etc.);begin supplying current to the heating element 120 channel(s) if theresistance for each channel tests within the specified range; and throwa flag if the resistance for one or more channels tests outside of thespecified range. In this example, the power module 150 can issue anaudible or visual warning locally—such as through a buzzer or LEDintegrated into the power module 150—in order to indicate to the userthat the power module 150 is incorrectly installed in the garment no.Alternatively, on start up, the power module 150 can test theresistances (or inductances, etc.) between various combinations ofchannel pairs, transform these resistance values into a pin-out map, andreconfigure connections between the male snap button ends and I/O portson an internal controller, the battery, etc. However, the power module150 can implement any other suitable method or technique to test eachchannel for proper connection.

In another example, the system 100 can include a pre-loaded ID chiparranged in the garment 110 and connected to a dedicated female snapbutton end on the garment no. In this example, when the power module 150is connected to the garment no by mating male snap button ends in thepower module 150 with corresponding female snap button ends on thegarment 110 or when the power module 150 is powered ON, the power module150 can read the ID chip—via the corresponding snap button—to determinethat the power module 150 is correctly installed in the garment no. Inthis example, the power module 150 can also identify the make or modelof the garment 110 and then retrieve (e.g., from local memory) andimplement a heating model (e.g., a closed-loop feedback, duty cycleparameters, etc.) specific to the make or model of the garment 110 basedon the identification data received from the ID chip in the garment no.In particular, in this example, the power module 150 can be configuredfor installation on any number of garments, such as various jackets,pants, socks, scarves, hats, etc., each associated with differentheating and temperature monitoring parameters and each including an IDchip pre-loaded with a digital identifier; the power module 150 cantherefore read a digital identifier from an ID chip in a connectedgarment and automatically reconfigure itself to interface with theconnected garment.

However, the power module 150 can implement any other suitable method ortechnique to identify and to interface with the garment no.

2. Conductive Ink

As shown in FIG. 4, a conductive ink 210 includes: a volume of volatilesolvent 210; a volume of conductive particulate 230 contained in thevolume of volatile solvent 210; and polymer particles 220 dissolved inthe volume of volatile solvent 210.

2.1 Applications

The conductive ink 200 includes: a volatile solvent 210; and conductiveparticulate 230 and polymer particles 220 in solution or in suspensionin the volatile solvent 210. Generally, the conductive ink 200 can bedeposited in liquid form—such as in the form of a bead, line, orpad—onto a section of fabric to form a conductive electrode, trace, orpad within of electrical circuit. As the solvent 210 evaporates, thepolymer particles 220 congeal around the conductive particulate 230 toform a polymer-based, flexible, conductive structure. For example, wheninitially deposited onto a fabric section, the conductive ink 200 cancontain equal parts of solvent 210, conductive particulate 230, andpolymer particles 220. Once the solvent 210 has fully evaporated fromthe conductive ink 200 (i.e., once the conductive ink 200 has cured),the conductive ink 200 can contain equal parts conductive particulate230 and polymer particles 220.

The conductive particulate 230 can include conductive metallicnanoparticles, such a silver nanoparticles or copper nanoparticles.Alternatively, the conductive particulate 230 can include conductivecarbon nanotubes or any other suitable type of conductive particulate230, particle, or powder.

The polymer particles 220 can include rubber particles—such as naturalor synthetic non-vulcanized rubber microparticles—that dissolve in thesolvent 210 to form an emulsion. Once the conductive ink 200 isdeposited onto a surface (e.g., onto a textile) and the solvent 210begins to evaporate, the polymer particles 220 can harden around theconductive particulate 230 to form a flexible conductive structure.Furthermore, as the solvent 210 evaporates, the polymer particles 220can also bond to the adjacent surface, such as chemically ormechanically by forming around threads in the fabric.

The polymer particles 220 can be hydrophobic and water-resistant suchthat an assembly of fabric and conductive ink 200 traces can bewashed—such as by dry cleaning or in a commercial or residential washingmachine—without substantial impart to the size, shape, and conductivityof conductive ink 200 traces. In particular, the polymer particles 220may not be dissolvable in water such that cured conductive ink 200 doesnot wash out of a fabric when exposed to water. Once dry and hardened(i.e., “cured,” such as by drying over time or by heating), the polymerparticles 220 can also encase conductive particulate 230 to minimizeoxidation of the conductive particulate 230 over time, such as when thefabric is exposed to moist air or water during use. However, the polymerparticles 220 can be of any other suitable type of polymer.

The solvent 210 can include hexane or any other suitable type of solventcapable of dissolving the polymer particles 220 and volatile in anenvironment suitable for a textile (e.g., at or near room temperature,at or near sea-level pressure). Generally, the solvent 210 functions todissolve the polymer particles 220 to form an emulsion (e.g., an aqueousmedium) in which conductive particulate 230 is supported and that can bedispensed onto a fabric or other surface. Once the conductive ink 200 isdispensed from a reservoir and thus exposed to a lower-pressure and/orhigher-temperature environment outside of the reservoir, the solvent 210evaporates from the emulsion, thus leaving the remaining polymerparticles 220 to harden around the conductive particulate 230 and toform a contiguous, flexible structure (i.e., to “cure”). When theconductive ink 200 is dispensed onto a fabric, the solvent 210 can alsofunction to activate (e.g., soften) an adjacent area of a the fabric,which may improve chemical and/or mechanical bonding between theactivated area of the fabric and the polymer particulate in theconductive ink 200 as the solvent 210 evaporates. As conductive ink 200in liquid form meets the surface of a fabric, the solvent 210 can alsoclean dirt, oils, and other debris from a local surface of the fabric,thereby preparing the fabric to bond to the polymer particles 220 as theconductive ink 200 cures. However, the solvent 210 can include any othersuitable type of solvent and can function in any other way to dissolvepolymer particle, to activate or clean a fabric, and to evaporate,thereby leaving the conductive particulate 230 and the polymer particles220 to bond to the fabric in the form of a trace layout in an electricalcircuit.

3. Ink Deposition System and First Method

As shown in FIG. 7, a first method S100 for manufacturing electricalcircuits on textiles includes: at a first time, depositing a volume ofconductive ink on a surface of a fabric section according to a tracelayout defining a trace break in Block S120; at a second time succeedingthe first time by a duration less than a drying period of the volume ofconductive ink, setting an electrical component in the volume ofconductive ink and across the trace break in Block S130; and, at a thirdtime succeeding the second time, depositing a volume of nonconductivesealant over the volume of conductive ink in Block S140.

One variation of the first method S100 includes: tensioning a fabricsection in a first direction in Block S110; at a first time, depositinga volume of conductive ink on a surface of the fabric section accordingto a trace layout in Block S120; at a second time succeeding the firsttime by a duration corresponding to a drying period of the volume ofconductive ink, releasing the fabric section in Block S112; anddepositing a volume of nonconductive sealant over the volume ofconductive ink in Block S140.

As shown in FIG. 6, an ink deposition system 300 can include: anextruder 310 configured to dispense conductive ink onto fabric sections;a component placement subsystem 320 configured to place electricalcomponents onto fabric sections; a set of fingers 332 configured tograsp and/or tension a fabric section; a trace former 340 configured toform a volume of deposited conductive ink into a trace of a particularheight and/or width; a punch configured to remove material from fabricsections in preparation to receive conductive ink; and/or a surfaceactivator subsystem configured to dispense a solvent onto a fabricsection to locally activate regions of the fabric section in preparationto receive conductive ink, as described below.

3.1 Applications

Generally, the ink deposition system 300 functions to deposit conductiveink onto a textile according to the first method S100 to form traces ofa flexible electric circuit directly on the textile. The ink depositionsystem 300 can also place electrical components, such as sensors,capacitors, resistors, switches, batteries, and/or other passive andactive circuit components onto the textile to complete a flexible,textile-backed circuit. The textile (e.g., a “fabric,” a “fabricsection,” or a “pattern piece”) can then be formed into an electrifiedgarment or other soft good. In particular, the textile—includingconductive ink and electrical components, can be integrated into agarment as a single electrified and aesthetic layer or integrated into atwo-layer garment as an inner lining. The ink deposition system 300 cantherefore manufacture electrical circuits directly onto fabric suitablefor single-layer or two-layer garments, thereby eliminating a need for athird electrified layer in a “smart” garment.

3.2 Ink Deposition

Block S120 of the first method S100 recites, at a first time, depositinga volume of conductive ink on a surface of a fabric section according toa trace layout defining a trace break. Generally, in Block S120, the inkdeposition system 300 functions to deposit one or more lines ofconductive ink onto a section of fabric according to a trace layoutselected for the section of fabric. In one implementation, the inkdeposition system 300 includes: a planar processing platform 302 onwhich a fabric section is processed; a conductive ink reservoir 314; anextruder 310 configured to dispense a stream of liquid conductive inkfrom the conductive ink reservoir 314 onto the fabric section placed onthe processing platform 302; and an actuator subsystem 312 (e.g., agantry, a multi-axis robotic arm, an X-Y table) configured to move theextruder 310 relative to the processing platform 302 according to atrace layout selected for the fabric section.

In the foregoing implementation, the extruder 310 can include a flowmeter, a nozzle of variable diameter, a metering valve, a pump, and/orany other subsystem suitable to meter a volume flow rate out of theextruder 310. The ink deposition system 300 can thus control a flow rateof conductive ink through the extruder 310 to achieve a targetcross-sectional area of each line (or “trace”) of conductive inkdeposited onto a fabric section. The ink deposition system 300 can alsovary the width of the extruder nozzle in order to modify the width of adeposited line of conductive ink, and the ink deposition system 300 canvary a speed of the actuator subsystem 312 arranged between theprocessing platform 302 and the extruder 310 in order to control a localcross-sectional area of deposited line of conductive ink. In particular,the conductive ink can exhibit electrical conductivity that variesproportional to its cross-sectional area; the ink deposition system 300can therefore manipulate one or more subsystem within or coupled to theextruder 310 to achieve target conductivity (and therefore electricalresistance) of local traces of conductive ink of deposited onto a fabricsection.

Through the extruder 310, the ink deposition system 300 can deposit oneor more discrete traces, electrodes, pads for electrical components,etc. of conductive ink of one or more widths and/or heights on a fabricsection in Block S120. For example, the ink deposition system 300 can:open the extruder 310 to deposit ink and activate the actuator subsystem312 to deposit a contiguous line of conductive ink; intermittently closethe extruder 310 to form an break in a line of conductive suitable toreceive an electrical component in Block S130; and raster the extruder310 over an area of a fabric section to form an electrode. One or morebatteries, sensors, actuators, passive circuit components, and/or activecircuit components, etc. can then installed on (e.g., bonded to) theconductive ink traces to form a circuit on the fabric section, as inBlock S130 described below.

3.3 Tensioning

One variation of the first method S100 includes Block S110, whichrecites tensioning a fabric section in a first direction. Generally, inBlock S110, the ink deposition system 300 functions to tension (e.g.,“stretch”) a section of fabric in preparation to receive conductive ink.In this variation, the ink deposition system 300 can include a fabrictensioning subsystem 330 configured to maintain textile (fabric) sheetin a tensioned configuration while conductive ink is deposited onto thefabric section in order to expose opens in the fabric section into whichconductive ink may wick before fully curing. In particular, bytensioning a fabric section before depositing conductive ink onto thefabric section, the ink deposition system 300 can achieve greater localsurface contact between the fabric section and the conductive ink andtherefore achieve improved local bonding between the fabric section andthe conductive ink per unit volume of conductive ink deposited onto thefabric.

In one implementation, the ink deposition system 300 processes a bolt offabric by sequentially tensioning and depositing conductive ink ontoadjacent sections of fabric along the length of the bolt of fabric. Inthis implementation, the ink deposition system 300 can include: a firstspool that supports an unprocessed bolt of fabric; a second spoollongitudinally offset from the first spool opposite a processingplatform 302 and configured to receive fabric from the first spool; anda set of fingers 332 arranged longitudinally along the processingplatform 302, configured to transiently grasp fabric over the processingplatform 302, and operable to laterally tension fabric over theprocessing platform 302. For example, the ink deposition system 300 caninclude a pair of longitudinal fingers on each side of the processingplatform 302, substantially perpendicular to the spools, and includingprongs extending downward to engage a local section of fabric near itsperimeter when the fingers are closed.

In the foregoing implementation, both the first and second spools can bemotorized and can cooperate to move the fabric and to tension localsection of the fabric across the processing platform 302. Alternatively,the ink deposition system 300 can include a second set of fingers 332arranged laterally over the processing platform 302 between the firstand second spools, configured to transiently grasp fabric over theprocessing platform 302, and operable to longitudinally tension fabricover the processing platform 302. The ink deposition system 300 cantherefore automatically tension a local section of fabric laterallyand/or longitudinally in Block S110, deposit conductive ink onto thelocal section of fabric in in Block S120, release tension on the localsection of fabric in Block S112 once the conductive ink is deposited,place electrical components onto the local section of fabric in BlockS130, advance the rollers forward to expose an adjacent local section ofthe fabric, and then repeat this process until the bolt is fullyprocessed. In this implementation, the ink deposition system 300 candeposit conductive ink according to one trace layout across multipleadjacent segments of fabric, deposit conductive ink according to onetrace layout across a single segment of fabric, or deposit conductiveink in multiple similar or distinct trace layouts across a singlesegment of fabric.

In another implementation, the ink deposition system 300 processes asection of fabric following removal of the fabric section from a fabricbolt. In one example implementation, the ink deposition system 300:receives a single pattern piece cut to size; tensions the single patternpiece; deposits conductive ink, electrical components, and/ornonconductive sealant, etc. onto the single pattern piece; and thenreleases the single pattern piece to complete a pattern piece processingcycle. In this example implementation, the ink deposition system 300 caninclude an optical scanning subsystem configured to scan the processingplatform 302, to identify the pattern piece (or multiple distinctpattern pieces) placed across the processing platform 302, and to set anorigin location and orientation for a subsequent pattern pieceprocessing cycle based on the detected position of the pattern piece onthe processing platform 302; the ink deposition system 300 can thenexecute the pattern piece processing cycle based on the origin locationand orientation set specifically for the detected pattern piece, such asby transforming a two-dimensional tension pattern, a two-dimensionaltrace layout, a component placement map, and a two-dimensional sealantpattern from a stock origin to the detected origin of the pattern piece.However, in this example, the ink deposition system 300 can implementany other optical, mechanical, capacitive, or other technique to detecta pattern piece placed on the processing platform 302 and to map apattern piece processing cycle to the detected pattern piece.

In the foregoing example implementation, the ink deposition system 300can also include a set of fingers 332 and a set of actuators configuredto manipulate the fingers across in two dimensions across the processingplatform 302 to grasp, tension, and release a pattern piece according toa pattern piece processing cycle, such as regardless of orientation ofthe pattern piece placed on the processing platform 302. In this exampleimplementation, the ink deposition system 300 can detect a pattern pieceplaced on the processing platform 302, such as described above, and thenreposition the fingers to grasp the pattern piece and to tension thepattern piece over its original position on the processing platform 302according to the pattern piece processing cycle elected for patternpiece. Alternatively, the ink deposition system 300 can manipulate thefingers to automatically move the pattern piece to a default originbefore executing the pattern piece processing cycle, as described below.

In another example implementation, the ink deposition system 300 canprocess a section of fabric containing regions designated for multiplepattern pieces, such as a (sub)set of pattern pieces for one garment ormultiple pattern pieces of the same type and geometry. In this exampleimplementation, the ink deposition system 300 can include: a set oflongitudinal and/or lateral fingers; and a set of actuators thatmanipulate the fingers to grasp edges of a fabric section and then drawopposing fingers outwardly to tension the fabric section beforeconductive ink is deposited onto the fabric section.

However, the ink deposition system 300 can include any other suitablemechanism or subsystem configured to grasp or retain an edge of asection of fabric and to tension the section of fabric along one or moreaxes.

3.4 Tension Release

This variation of the first method S100 also includes Block S112, whichrecites, at a second time succeeding the first time by a durationcorresponding to a drying period of the volume of conductive ink,releasing the fabric section. Generally, in Block S112, the inkdeposition system 300 can release tension on a fabric section beforedeposited conductive ink is fully dry (i.e., “cured”) in order toprevent permanent local deformation of the fabric section due tooverabundance of conductive ink in opens within the fabric section oncethe conductive ink has hardened.

In the implementation described above in which the ink deposition system300 receives a single pattern piece, the tensioning subsystem 330 canactuate various fingers to grasp the perimeter of the pattern piece,store the positions of the fingers at first contact with the patternpiece as an initial position set, and then draw the fingers toward theperimeter of the processing platform 302 by a preset offset distancefrom the initial position set in order to achieve a target tension inthe pattern piece in Block S110. Then, within a period of timesubstantially less than a hardening time of the conductive ink, theextruder 310 can deposit conductive ink on the surface of the patternpiece according to a full trace layout designated for the pattern piece.Once the full trace layout of the conductive ink is deposited on thepattern piece and before the deposited conductive ink is sufficientlyhardened, the tensioning subsystem 330 can return the fingers to theirinitial grasp positions according to the initial position set in BlockS112, thereby releasing tension on the pattern piece.

In the foregoing implementation, the ink deposition system 300 candefine an enclosed volume over the processing platform 302 and caninclude a cooling subsystem that modulates the ambient temperature overthe processing platform 302 to control a hardening rate (or a cure rate)of the conductive ink. For example, the solvent in the conductive inkcan evaporate at a rate proportional to local ambient temperature; thecooling subsystem within the ink deposition system 300 can thereforemaintain a reduced temperature over the processing platform 302 (e.g.,40° F.) to lengthen the hardening time of conductive ink, such as inorder to prevent deposited conductive ink from hardening in opens in afabric section before tension on the fabric section is released.Similarly, the solvent in the conductive ink can evaporate at a rateinversely proportional to local ambient pressure; the ink depositionsystem 300 can therefore define a pressure vessel around the processingplatform 302 and can include a pump that intermittently increasesambient pressure over the processing platform 302 to reduce evaporationof the solvent, thereby delaying hardening of deposited conductive inkuntil a pattern piece is untensioned. In this implementation, the inkdeposition system 300 can also draw a vacuum on the pressure vessel toincrease evaporation of solvent from deposited conductive ink once thepattern piece is untensioned.

In another implementation, the conductive ink can include a type and/orconcentration of solvent sufficient to yield a conductive ink hardeningtime substantially greater than a time necessary to deposit a full tracelayout on a pattern piece. In this implementation, the ink depositionsystem 300 can include a heating subsystem that elevates the local airtemperature over the processing platform 302 to more rapidly evaporatethe solvent and to harden deposited conductive ink once tension on thepattern piece is removed or reduced in Block S112. For example, theheating subsystem can include a resistive heating element coupled to theextruder 310, and the ink deposition system 300 can draw actuate theresistive heating element and manipulate the extruder 310 over thepattern piece according to the trace layout in order to rapidlyevaporate the solvent from the conductive ink, thereby hardening theconductive ink into the trace layout.

In yet another implementation, the ink deposition system 300 can includea solvent reservoir and valve coupled to the extruder 310, and theextruder 310 can include a mixing nozzle that mixes solvent fed from thesolvent reservoir with conductive ink from the conductive ink reservoir314 before dispensing conductive ink onto a pattern piece. In thisimplementation, the ink deposition system 300 can vary an amount ofadditional solvent added to the conductive ink throughout a patternpiece processing cycle in order to achieve target hardening times forconductive ink thus deposited. For example, the ink deposition system300 can add a greatest volume of additional solvent—corresponding to aknown or anticipated duration of a pattern piece processing cycle—to theconductive ink at the beginning of the pattern piece processing cycle,and the ink deposition system 300 can reduce the volume of additionalsolvent added to the conductive ink as the pattern piece processingcycle progresses such that all conductive ink deposited on the patternpiece hardens at substantially the same time.

However, the ink deposition system 300 can include any other subsystemto modify the conductive ink or one or more ambient conditions over theprocessing platform 302 to control a hardening time (and/or a cure time)of conductive deposited onto a pattern piece or other fabric section.

3.5 Component Placement

Block S130 of the first method S100 recites, at a second time succeedingthe first time by a duration less than a drying period of the volume ofconductive ink, setting an electrical component in the volume ofconductive ink and across the trace break. Generally, in Block S130, theink deposition system 300 functions to place one or more batteries,sensors, actuators, passive circuit components, and/or active circuitcomponents, etc. on a fabric section. For example, the ink depositionsystem 300 can include a component placement subsystem 320 implementingcomponent placement techniques to select surface-mount circuitcomponents from a set of component reels, to orient components forcorresponding positions on a fabric section, and to place components onthe fabric section in their corresponding positions.

In one implementation, the ink deposition system 300 deposit conductiveink onto a fabric section according to a trace layout in Block S120,places components onto the fabric section with leads directly immersedinto and retained by the uncured conductive ink in Block S130, and thendeposits a sealant over the conductive ink (and the installed electricalcomponents) once the conductive ink is sufficiently dry. For example,once conductive ink is deposited onto a fabric section, the componentplacement subsystem 320 can place an electrical component directly ontothe fabric section such that surface-mount pins or flat contact leads ofthe component contact and are retained by corresponding two or morecorresponding traces of uncured conductive ink terminating at theplacement location of the electrical component. In this implementation,the component placement subsystem 320 can place electrical components onthe fabric section within a threshold period of time less than a curetime of the conductive ink at a deposited cross-sectional area, and theink deposition system 300 can deposit sealant over conductive ink tracesonce the cure time has passed for all or local sections of theconductive ink trace layout.

In a similar implementation, the ink deposition system 300 furtherincludes an adhesive dispenser configured to deposit adhesive onto afabric section at or near the target location of electrical componentsto be subsequently installed on the fabric section in Block S130. Forexample, ink deposition system 300 can: dispense conductive ink onto thefabric section according to a trace layout; manipulate the adhesivedispenser to dispense beads of adhesive onto the fabric section attarget locations for electrical components; and then actuate thecomponent placement subsystem 320 to place electrical components intocorresponding beads of adhesive and into contact with the correspondingconductive ink traces. The ink deposition system 300 can thus dispenseadhesive onto a fabric section to bond electrical components to thefabric section. Alternatively, the ink deposition system 300 can first:manipulate the adhesive dispenser to dispense beads of adhesive onto thefabric section at target locations for electrical components; actuatethe component placement subsystem 320 to place electrical componentsinto corresponding beads of adhesive on the fabric section; and onlythen dispense conductive ink onto the fabric section to connect leads(e.g., flat leads) on the electrical components—held in place by theadhesive—according to the trace layout selected for the fabric section.

The ink deposition system 300 can thus dispense adhesive onto a fabricsection to bond electrical components to the fabric section. In thisimplementation, the adhesive dispenser can dispense a UV-curableadhesive, and the ink deposition system 300 can cure dispensed adhesiveby activating a UV light source over the processing platform 302 oncethe electrical components are in place on the fabric section.Alternatively, the ink deposition system 300 can heat the fabric sectionto cure dispensed adhesive or allow the adhesive to cure over time.

In the variation of the ink deposition system 300 that includes atensioning subsystem 330, as described above, the ink deposition system300 can place electrical components on the fabric section after thetensioning subsystem 330 returns the fabric section to an untensioned(or to a minimally tensioned) state. For example, the ink depositionsystem 300 can first tension a fabric section in Block S110; depositconductive ink on the tensioned fabric section; return the fabricsection to a substantially untensioned state; and then place electricalcomponents on the fabric section prior to full hardening of theconductive ink.

However, the ink deposition system 300 can place electrical componentson a fabric section in any other way and according to any other schema.

3.6 Trace Former

The ink deposition system 300 can also include a die roller, and the inkdeposition system 300 can draw the die roller over a trace of conductiveink deposited onto a fabric section to form the height and/or width ofthe trace and/or to drive conductive ink into the fabric section. In oneexample, the ink deposition system 300 includes: a cylindrical dieroller defining a groove of width and depth corresponding to a targettrace width and to a target trace height, respectively, about the outercylindrical surface of the die roller; and a spindle coupled to theextruder 310 head, supporting the die roller over the processingplatform 302, and configured to orient the die roller (along a Z-axis ofthe processing platform 302). In this example, once the ink depositionsystem 300 deposits a line of conductive ink onto a fabric section, theink deposition system 300 can drive the die roller downward to contactthe fabric section and then draw the die roller over the line ofconductive ink to form the line of conductive ink into a trace of atarget width and a target height corresponding to the groove defined bythe die roller. In this example, the fingers (and/or the spools) canretain the fabric section in place while the die roller is drawnlaterally and longitudinally across the surface of the fabric section.

In this implementation, the ink deposition system 300 can also include asolvent supply system that releases (e.g., “drips”) solvent (e.g.,hexane) onto the die roller as the ink deposition system 300 draws thedie roller across the surface of a fabric section in order to lubricatethe die roller and to dissolve conductive ink collected by the dieroller, thereby preventing conductive ink from collecting on the dieroller and preventing the die roller from sticking to a trace and/or tothe fabric section.

Furthermore, the ink deposition system 300 can include a set of dierollers, wherein each die roller defines a groove of a unique width anddepth—within the set of die rollers—on its outer cylindrical surface.The ink deposition system 300 can thus select a particular dieroller—from the set of die rollers—based on a specified width and heightof a trace for a fabric section and then draw the selected die rollerover a corresponding line of conductive ink previously deposited ontothe fabric section.

In this variation, the ink deposition system 300 can also include one ormore flat dies that define cavities corresponding to three-dimensionalelectrode, trace, and/or pad geometries for conductive ink. For example,the ink deposition system 300 can include: a first die defining a groupof recesses corresponding to three-dimensional trace terminals for 3316metric surface mount package sizes (e.g., for resistors, capacitors);and a second die defining a recess corresponding to a three-dimensionaltrace electrode for a battery terminal or power connector. In thisimplementation, prior to placing components on a fabric section in BlockS130, the ink deposition system 300 can select a flat die—from a set ofavailable flat dies—and stamp the selected flat die into uncuredconductive ink on the fabric section to locally form the conductive inkinto a particular three-dimensional structure suitable to accept aparticular electrical component.

However, the ink deposition system 300 can post-process or formconductive ink deposited onto a fabric section in any other suitableway.

3.7 Punch

The ink deposition system 300 can include a punch, a die, and a punchactuator configured to punch holes in a fabric section, such as in apattern along one or more lines designated to receive conductive ink ona fabric section. For example, prior to depositing conductive ink onto afabric section, the ink deposition system 300 can drive the punch intoselect points on the fabric section (and onto the die supporting thefabric section below) to punch a sequence of holes, and the inkdeposition system 300 can then deposit conductive ink in one or morelines coincident these holes on the surface of the fabric section. Inthis example, the conductive ink can flow into these holes (and to theback surface of the fabric section) in order to achieve greater adhesionbetween the traces of conductive ink and the fabric section once theconductive ink is cured.

3.8 Surface Activator

The ink deposition system 300 can include a surface activator subsystemconfigured to dispense a solvent onto a fabric section to locallyactivate regions of the fabric section in preparation to receiveconductive ink. For example, the ink deposition system 300 can include:a reservoir configured to contain a volume of solvent (e.g., hexane); anozzle fluidly coupled to the reservoir and supported on the extruder310; and a pump configured to selectively pump solvent from thereservoir into the nozzle. In this implementation, prior to dispensingconductive ink onto a fabric section, the ink deposition system 300 candrive the nozzle downward onto (or substantially near) the surface ofthe fabric section, actuate the pump, and the move the nozzle laterallyand/or longitudinally across the fabric section—following a trace pathdesignated for the fabric section; solvent thus dispensed onto thefabric section can clean and activate select regions of the fabricsection in preparation to bond with a line of conductive ink.

The ink deposition system 300 can additionally or alternatively include:a vacuum supply and nozzle configured to collect dust and debris from afabric section; a plasma surface activator configured to activate localregions of a fabric section; or any other subsystem configured toprepare all or select areas of a fabric section to bond with a volume ofconductive ink.

3.9 Sealant Deposition

Block S140 of the first method S100 recites depositing a volume ofnonconductive sealant over the volume of conductive ink. Generally, inBlock S140, the ink deposition system 300 functions to deposit a sealantover conductive ink traces and/or electrical components deposited onto afabric section. In one implementation, the ink deposition system 300includes a sealant reservoir 316 and a sealant extruder coupled to theconductive ink extruder described above. Once conductive ink isdeposited into a fabric section, electrical components placed on thefabric section, and the conductive ink suitably hardened or cured, theink deposition system 300 can actuate the actuator subsystem 312 to drawthe sealant extruder across conductive ink traces on the fabric section.In this implementation, the sealant extruder can include a nozzlebroader (i.e., wider) that a nozzle in the conductive ink extruder suchthat sealant deposited by the sealant extruder extends beyond the fullwidth of a conductive ink trace and onto an adjacent area of fabric,thereby sealing both the top and side of the conductive ink trace.

The sealant extruder can deposit sealant similar to the conductive inkbut substantially nonconductive. For example, the sealant extruder candeposit a sealant of a volatile solvent and polymer particlessubstantially identical to the solvent and polymer particles of theconductive ink (e.g., hexane and natural non-vulcanized rubbermicroparticles). In liquid form, the polymer particles of the sealantcan be dissolved in solution (or in suspension) in the volatile solvent,and the solvent can evaporate following application onto a fabric, thusleaving polymer particles to harden and bond to the fabric. Like solventin the conductive ink, when sealant is deposited into a fabric section,solvent in the sealant can similarly activate an adjacent region of thefabric section and superficially soften an adjacent trace of conductiveink, thus preparing the fabric and the conductive ink trace to bond withthe polymer particles in the sealant.

The sealant can be colored with a dye, tint, or other coloredparticulate. For example, the sealant can be color-matched to a fabricsection and deposited over conductive ink traces and electricalcomponents previously deposited onto the fabric section, therebyconcealing the conductive ink traces and the electrical components.

However, the ink deposition system 300 can deposit a sealant of anyother type in any other way onto a conductive ink trace and/or onto aelectrical component dispensed onto a fabric section.

3.10 Alternative Inks

In one variation, the ink deposition system 300 deposits a magnetic ink.In this variation, the magnetic ink can include a volume of solvent andpolymer particles like the conductive ink; rather than conductiveparticulate, the magnetic ink can include magnetic particulate, such asneodymium, rare earth, ceramic, samarium cobalt, or alnico permanentmagnet nanoparticles. In this variation, the ink deposition system 300can also include a magnetic field driver that induces a directionalmagnetic field across the processing platform 302 as the magnetic inkhardens and cures such that the magnetic ink maintains a desiredmagnetic polarity once the magnetic ink has cured. The ink depositionsystem 300 can therefore dispense a magnetic ink onto a fabric sectionand induce a directional magnetic field across the fabric section toproduce a flexible permanent magnet on a fabric backing.

In another variation, the ink deposition system 300 deposits n-type andp-type silicone inks. For example, the ink deposition system 300 candeposit an n-type silicone ink including a volume of solvent, polymerparticles, and particles of silicone doped with phosphorus. In thisexample, the ink deposition system 300 can deposit a p-type silicone inkincluding a volume of solvent, polymer particles, and particles ofsilicone doped with boron. In this variation, the ink deposition system300 can selectively deposited n-type silicone ink and p-type siliconeink onto a fabric section to construct a transistor (e.g., a BJT, a FET)directly onto the fabric section.

In yet another variation, the ink deposition system 300 deposits:battery electrode ink containing solvent, polymer particles, andparticulate for an electrode of a metal-air battery, such as lithium orzinc particulate; and an electrolytic ink, such as carbonate (e.g., acarbonic acid salt) particulate in an aqueous suspension of polymerparticles (e.g., natural rubber) and solvent. In this variation, aregion of a fabric section can function as a porous cathode, and the inkdeposition system 300 can: deposit a trace of conductive ink over theregion of the fabric section to form a conductive lead from the cathode;deposit a layer (e.g., a 3″-wide, 3″-long, 0.06″ layer) of electrolyticink over the region of the fabric section to form an electrolyte layer;deposit a layer of battery electrode ink over the electrolyte layer toform an anode; and then deposit a trace of conductive ink over the layerof battery electrode ink to form a conductive lead from the cathode. Theink deposition system 300 can thus fabricate a flexible metal-airbattery directly onto a fabric section and can connect this batteryother electrical components or circuits on the fabric section viaadditional traces of conductive ink. The ink deposition system 300 canalso seal the outer surface of a battery anode with sealant, asdescribed above.

However, the ink deposition system 300 can deposit inks of any othertype onto the fabric to construct any other suitable electrical circuit,electoral component, etc.

4. Garment, Garment Insert, and Second Method

As shown in FIG. 8, a second method S200 for fabricating a garmentincludes: applying a first mask to a first side of a fabric substrate420 coated with a conductive material in Block S210; applying a secondmask to a second side of the fabric substrate 420 opposite the firstside, the second mask including a mirrored image of the first mask inBlock S212; applying an etchant to the fabric substrate 420 to removeconductive material outside of the first mask in Block S214; arranging aconductive interface pad 446 of a component carrier 440 over anelectrode 444 defined by remaining conductive material on the fabricsubstrate 420 in Block S230, the component carrier 440 including aflexible substrate 442 and a rigid electrical component 444 mounted tothe flexible substrate 442, the conductive interface pad 446 extendingfrom a terminal of the rigid electrical component 444 across a region ofthe flexible substrate 442; mechanically fastening the component carrier440 to the fabric substrate 420 to form a garment insert 410 includingan electrical circuit in Block S240; and incorporating the garmentinsert 410 into the garment 400 in Block S250.

As shown in FIG. 9, a garment 400 includes: an outer layer including atextile; a lining including a textile; and a garment insert 410interposed between the outer layer and the lining. The garment insert410 includes: a fabric substrate 420; a layer of conductive material 430coated onto a first side of the fabric substrate 420 and selectivelyetched from the fabric substrate 420 to form traces 432 of an electricalcircuit 436 across the fabric substrate 420; and a component carrier440. The component carrier 440: includes a flexible substrate 442, arigid electrical component 444 mounted to the flexible substrate 442,and a first conductive interface pad 446 extending from a first terminalof the rigid electrical component 444; and is mechanically coupled tothe fabric substrate 420 with the first conductive interface pad 446arranged over and electrically coupled to the layer of conductivematerial 430 to complete the electrical circuit.

As shown in FIG. 9, a garment insert 410 configured to be sewn into agarment includes: a fabric substrate 420; a layer of conductive material430 coated onto a first side of the fabric substrate 420 and selectivelyetched from the fabric substrate 420 to form an electrode 444 within anelectrical circuit on the fabric substrate 420; a volume of conductiveink 460 applied over the layer of conductive material 430 at theelectrode 444; and a component carrier 440. The component carrier 440:includes a flexible substrate 442, an electrical component 444 mountedto the flexible substrate 442, and a conductive interface pad 446arranged on the substrate and extending from a terminal of theelectrical component 444; and is arranged over the fabric substrate 420with the conductive interface pad 446 in contact with the volume ofconductive ink 460 opposite the layer of conductive material 430. Thegarment insert 410 further includes: a filament 450 passing through thefabric substrate 420 and the component carrier 440 and configured toconstrain the fabric substrate 420 and the component carrier 440 againstthe volume of conductive ink 460.

4.1 Applications

Generally, the second method S200 can be executed to produce a garmentcontaining an electrical circuit fabricated across a flexible, fabricsubstrate 420. For example, the second method S200 can be executed toproduce a shirt, a blouse, a vest, a dress, or a jacket containing:resistive heating elements (as described above) that output heat toimprove a user's comfort; light-emitting diodes (“LEDs”) that outputlight to improve the user's visibility to others as night; or abiometric sensor that detects a biosignal of the user; and a flexible,on-fabric wireless antenna and wireless transceiver for communicatingdata between the garment 400 and an external device (e.g., a smartphone,a tablet). Blocks of the second method S200 can be similarly implementedto produce a garment insert 410 (or a “patch”) defining a standaloneflexible textile-based circuit that can later be incorporated into agarment by a user or other supplier, such as with a clothes iron, withfabric adhesive, or by stitching.

The second method S200 can therefore be executed to produce a unit ofthe garment insert 410 containing: a fabric (i.e., “textile”) substrate,such as cotton or taffeta; a conductive material selectively applied to(e.g., via screen printing) or plated onto and selectively etched fromthe fabric substrate 420 to form traces 432 of an electrical circuit436; and a component carrier 440 containing a flexible electroniccircuit board and a rigid electrical component 444 mounted to the fabricsubstrate 420 in contact with the conductive material to complete theelectrical circuit. The garment insert 410 can also include multiplecomponent carriers—such as component carriers containing one of abattery, a biometric sensor, a LED, a switch, and a controller—thatcooperate with traces fabricated across the fabric substrate 420 tocomplete an electrical circuit. By connecting electricalcomponents—mounted to component carriers—via conductive tracesfabricated on a fabric substrate 420, the garment insert 410 can remainsoft and flexible, can be incorporated into a garment with traditionalgarment production techniques, and can be substantially free of wires ora wiring harness that may add bulk, complexity, and fragility to afabric-based electrical circuit. In particular, the garment insert 410can include both: fabric-based components (i.e., the fabric substrate420 and the conductive layer) produced by a textile manufactureraccording to traditional textile production techniques, such as screenprinting and acid washing; and electronics components (i.e., thecomponent carrier 440 and the electrical component 444) produced by anelectronics manufacturer according to traditional electronics productiontechniques, such as PCB etching, component placement, and reflowing. Thefabric-based components and electronics components can then be assembledinto the garment insert 410 and/or integrated into a complete garment bythe textile manufacturer or by a garment manufacturer according totraditional garment production techniques, such as stitching, hemming,and pressing to create a flexible, soft smart-textile substantially freeof wires.

Blocks of the second method S200 can therefore be executed by one ormore of an electronics manufacturer, a textile manufacturer, and agarment manufacturer to produce a garment insert 410 or a completegarment configured to output light, to output heat, to output an audiosignal, to collect biosignal data (e.g., heart rate, skin temperature,skin conductivity, or arterial oxygen saturation, etc.), and/or totransmit user biosignal data to an external device, etc.

4.2 Fabric Substrate and Conductive Coating

Block S210 of the second method S200 recites applying a first mask to afirst side of a fabric substrate 420 coated with a conductive material;Block S212 of the second method S200 recites applying a second mask to asecond side of the fabric substrate 420 opposite the first side, thesecond mask including a mirrored image of the first mask; and Block S214of the method recites applying an etchant to the fabric substrate 420 toremove conductive material outside of the first mask. Generally, inBlocks S210, S212, and S214, a mask is applied to both sides of a fabricsubstrate 420 containing a conductive coating 430, and the conductivecoating 430 is then etched to selectively remove regions of theconductive coating 430 from the fabric substrate 420, as shown in FIG.8. In particular, in Blocks S210, S212, and S214, a first mask isapplied across a first side of the fabric substrate 420 and theconductive coating 430, a mirror of the first mask is applied theopposite side of the fabric substrate 420 in alignment with the firstmask, and an etchant is applied to both sides of the fabric substrate420 to etch (i.e., remove) the conductive material from both sides ofthe fabric substrate 420. Because the fabric substrate 420 may be porousto liquid and thus enable etchant to move laterally through the fabricsubstrate 420 and past the first mask as a function of etching time,both sides of the fabric substrate 420 can be masked and then exposed tothe etchant for a limited period of time to achieve complete removal ofthe conductive material outside of the first mask on the first side ofthe fabric substrate 420 while maintaining relatively high transferaccuracy of edges of the first mask to the final geometry of remainingconductive material on the fabric substrate 420.

The garment insert 410 includes: a fabric substrate 420; and a layer ofconductive material 430 (hereinafter the “conductive coating 430”)coated onto a first side of the fabric substrate 420 and selectivelyetched from the fabric substrate 420 to form traces 432 of an electricalcircuit 436 (e.g., including an electrode 444) across the fabricsubstrate 420. In one implementation, the fabric substrate 420 includesa section of woven textile, such as cotton-, flax-, jute-, hemp-,modal-, bamboo-, silk, velvet-, or taffeta-based fabric. In thisimplementation, the layer of conductive coating 430 includes a metal(e.g., copper) or a metal alloy (e.g., copper alloyed with silver, zinc,aluminum, nickel, and/or silicon) plated across one or both sides of thesection of woven textile. For example, the fabric substrate 420 and thelayer of conductive coating 430 can include a section of taffetaelectrolessly plated with copper to form copper taffeta. However, thefabric substrate 420 and layer of conductive coating 430 can be of anyother form or materials.

In Blocks S210 and S212, a mask is applied to the first and second sidesof the fabric substrate 420—that is, across the layer of conductivecoating 430—in preparation to selectively remove regions of the layer ofconductive coating 430 via etching, as shown in FIG. 8. In one example,a mask pattern is formed by removing sections corresponding to desiredregions of remaining conductive material on the fabric substrate 420from a vinyl sheet, such as with a computer-numeric-controlled (CNC)vinyl cutter. In this example, the material can be removed from thevinyl sheet to form a negative representation of one or more traces,electrodes, and/or contact pads, etc. The mask pattern is then centeredover the first side of the fabric section face up, and an etch resistmaterial is rolled or sprayed over the mask pattern in Block S210,thereby coating the desired regions of remaining conductive material onthe first side of the fabric substrate 420 with the etch resist. Themask pattern is subsequently inverted and centered over the second sideof the fabric section, and the etch resist material is rolled over theinverted mask pattern in Block S212, thereby coating the second side ofthe fabric section with etch resist directly adjacent desired regions ofremaining conductive material on the first side of the fabric substrate420.

In another example, a first mask and a second mask can be formed bytrimming a sheet of peel-and-stick or iron-on vinyl to remove sectionscorresponding to desired regions of remaining conductive material on thefirst side of the fabric substrate 420, such as with a CNC vinyl cutter,as described above. In this example, the first mask can then be adheredor ironed onto the first side of the fabric substrate 420 in Block S210,and the second mask can be similarly adhered or ironed onto the secondside of the fabric substrate 420 in alignment with the first mask above(i.e., features of the second mask in alignment with features of thefirst mask projected through the fabric substrate 420) in Block S212.

In yet another example, the first and second masks are screen-printedonto the first and second sides of the fabric section, respectively.Similarly, the first and second masks can be printed onto the first andsecond sides of the fabric section directly with an inkjet printer. Inyet another example, the first and second masks can be applied to thefabric substrate 420 via lithography. However, the first and secondmasks can be applied to the first and second sides of the fabricsubstrate 420 in any other suitable way in Blocks S210 and S212.

Once the etch resist is applied to both sides of the fabric substrate420, the fabric substrate 420 is exposed to etchant in Block S214 toremove sections of the conductive coating 430 not covered by the etchresist, as shown in FIG. 8. For example, liquid etchant (e.g., ferricchloride) can be sprayed onto the first and second sides of the fabricsubstrate 420. Alternatively, the fabric substrate 420—with conductivecoating 430, first mask, and second mask—can be placed in a bathcontaining liquid etchant. The fabric substrate 420 can be exposed toetchant for a particular period of time based on a thickness of theconductive coating 430 and a permeability of the fabric substrate 420 tothe etchant before the etchant is removed and/or neutralized. Inparticular, in the implementation in which the fabric substrate 420 iscoated on its first side only with conductive material and is submergedin an etchant bath following application of the first and second masks,etchant may permeate the second side of the fabric substrate 420 andetch the conductive coating 430 from its back side, thereby increasing(e.g., approximately doubling) an etch rate of the conductive coating430 as a function of the permeability of the fabric substrate 420 to theetchant. However, the etchant may also move laterally through the fabricsubstrate 420 as a function of the permeability of the fabric substrate420 to the etchant, thereby etching the conductive coating 430 under thefirst mask. However, because target regions of the conductive coating430 are etched from both sides of the fabric substrate 420, the rate ofvertical etching may be substantially greater than (e.g., twice) thetotal rate of lateral etching, thereby enabling complete removal oftarget regions of the conductive coating 430 with substantially minimaletching beyond the boundary of first mask.

In the foregoing implementation, once the etch time is complete, thefabric substrate 420 can be washed with a neutralizer (e.g., a basicsolution, such as including sodium bicarbonate) to cease etching andfurther removal of the conductive coating 430. The first and secondmasks can then be removed from the fabric substrate 420, such as bypeeling the masks from the fabric substrate 420 or by exposing thefabric substrate 420 to a second chemical solution configured todissolve the first and second mask material. Alternatively, only selectsections of the first and/or second masks can be removed from the fabricsubstrate 420 to expose conductive interface pads, electrodes, and/orother features of the conductive coating 430 for subsequent connectionto a component carrier 440 or other electronic device, such as bymechanically abrading the first and/or second mask to expose thesefeatures in the conductive coating 430.

In a similar implementation, the second mask can define a modifiedmirror image of the first mask but with widened mask areas. In oneexample in which the first mask defines a large unmasked area adjacentone or more narrow masked lines, the second mask can define a similarlarge unmasked area adjacent similar but wider masked lines in order toachieve a more rapid etch rate across a first region of the conceivecoating coincident the large unmasked area than around a second regionof the conceive coating coincident the narrow masked lines in BlockS214, thereby yielding greater etching control across small featuresresulting in traces etched into the conductive layer. In particular, thesecond mask can define larger masked features corresponding to featuresof the first mask in order to achieve local reduction in etch ratearound smaller, more sensitive, and/or more precise masked features byreducing local exposure to etchant from the second side of the fabricsubstrate 420.

Conversely, the second mask can define smaller masked featurescorresponding to features of the first mask in order to increase theconductive coating's local exposure to etchant from the second side ofthe fabric substrate 420, thereby increasing the local etch rate aroundsmaller, more sensitive, and/or more precise masked features to achievefiner traces and/or other features in the final etched layer ofconductive material 430.

In an alternative implementation, the fabric substrate 420 is coatedwith the layer of conductive material 430 on its first side only, thefirst mask is applied over the first side of the fabric substrate 420 toisolate select regions of the conductive coating 430 from the etchant,and the second side of the fabric substrate 420 is masked fully acrossits length and width to prevent or limit exposure of the back side ofthe conductive coating 430 to the etchant in Block S214. The fabriccoating and the conductive coating 430 can then be processed asdescribed above to selectively remove areas of the conductive coating430 from the first side of the fabric substrate 420. In thisimplementation, a section of the second mask corresponding to a largeunmasked region of the first mask can be removed or perforated (e.g.,with small bores or holes in a grid array) in order to expose theconductive coating 430 to additional etchant through the second side ofthe fabric substrate 420 and to selectively increase the etch rate of alarge, corresponding region of the conductive coating 430.

In another implementation, the fabric substrate 420 is coated with afirst layer of conductive material 430 on its first side and a secondlayer of conductive material 430 on its second side. In thisimplementation, the first conductive coating 430 can alone be masked inBlock S210, and the first conductive coating 430 can be selectivelyetched and the second conductive coating 431 fully etched in Block S214to form a single set of traces of the first side of the fabric substrate420. Alternatively, a first mask defining a first trace layout can beapplied to the first side of the fabric substrate 420 in Block S210, asecond mask defining a second trace layout—unique to the first tracelayout—can be applied to the second side of the fabric substrate 420 inBlock S212, and the fabric substrate 420 can be exposed to etchant inBlock S214 to form a first conductive trace on the first side of thefabric substrate 420 and a second conductive trace on the second side ofthe fabric substrate 420. In this implementation, the fabric substrate420 can thus function as a flexible, insulative substrate offsetting thefirst and second conductive layers.

In the foregoing implementation, a first electrode 444 defined by thefirst layer of conductive material 430 can be electrically coupled to asecond electrode opposite the first electrode 444 and defined by thesecond layer of conductive material 430 with a conductive threadstitched through the fabric substrate 420 and intersecting the first andsecond electrodes to form a “via.” Alternatively, the first and secondelectrodes can be electrically coupled with a metallic (e.g.,chrome-plated brass) rivet 490 or button installed in the fabricsubstrate 420 and intersecting the first and second electrodes. However,a region of the first conductive layer on the first side of the fabricsubstrate 420 can be electrically coupled to a region of the secondconductive layer on the second side of the fabric substrate 420 in anyother way. Furthermore, the fabric substrate 420 and the conductivecoating 430 can include any other materials fabricated in any other wayto form traces 432 of an electrical circuit 436 over a section offlexible woven textile.

4.3 Component Carrier

The component carrier 440 of the garment insert 410 includes: a flexiblesubstrate 442; a rigid electrical component 444 mounted to the flexiblesubstrate 442, and a first conductive interface pad 446 extending from afirst terminal of the rigid electrical component 444. The componentcarrier 440 is also mechanically coupled to the fabric substrate 420with the first conductive interface pad 446 arranged over andelectrically coupled to the layer of conductive material 430 to completethe electrical circuit. Generally, the component carrier 440 contains arigid electrical component 444 mounted to a flexible substrate 442(e.g., a flexible PCB) that, once installed on the fabric substrate 420,functions as an interface between the rigid electrical component 444 andthe soft, flexible, and/or elastic material of the fabric substrate 420.

In one implementation, the component carrier 440 defines a “button” thatis mechanically fastened and/or chemically adhered to the fabricsubstrate 420, as described below, and spans a small area of the fabricsubstrate 420. In this implementation, the component carrier 440includes: a flexible substrate 442, such as a polyimide substrate, apolyether ether ketone (PEEK) substrate, or a transparent polyester orplastic film; and an etched metallic (e.g., copper) layer defining asolder pad, a conductive interface pad 446, and a trace extendingbetween the solder pad and the conductive interface pad 446. Forexample, a component carrier 440 can include atwenty-millimeter-diameter round or five-millimeter by twenty-millimeterrectangular flexible PCB section and etched copper foil trace. In thisimplementation, a rigid electrical component 444 (e.g., asurface-mounted resistor, LED, or accelerometer) can be mounted to theflexible substrate 442 by soldering a terminal of the rigid electricalcomponent 444 to the solder pad, such as via surface-mount methods andtechniques including application of solder paste onto the solder pad,placement of the terminal of the rigid electrical component 444 into thesolder paste, and reflow. The component carrier 440 can then beinstalled onto the fabric substrate 420 with the conductive interfacepad 446 electrically coupled to an electrode 444 defined by a remainingregion of the conductive coating 430 on the fabric substrate 420, asdescribed below.

The component carrier 440 can include a single rigid electricalcomponent 444 and one conductive interface pad 446 per terminal of therigid electrical component 444. Alternatively, the component carrier 440can include multiple rigid electrical components and multiplecorresponding conductive interface pads.

In one example, the garment insert 410 defines a lighted safety vestinsert. In this example, the garment insert 410 can include multiplelighted component carriers, wherein each lighted component carrier 440includes a surface-mount LED and a resistor arranged in series between afirst conductive interface pad 446 and a second conductive interface pad446. In this example, the garment insert 410 can also include: a controlcomponent carrier 440 including a rigid analog switch; and a powercomponent carrier 440 including a rechargeable battery. The conductiveinterface pads of the lighted component carriers, control componentcarrier 440, and power carrier can be installed over correspondingelectrodes defined by the conductive coating 430 on the fabric substrate420 to complete an electrical circuit such that, when the analog switchon the control component carrier 440 is actuated, the battery on thepower component carrier 440 supplies power to LEDs on the lightedcomponent carriers via traces defined by the conductive layer on thefabric substrate 420. In this example, the garment insert 410 can beinstalled in a safety vest—including an outer layer and an innerlining—defining a first shoulder section and a second shoulder section.The garment insert 410 can thus define a patch applied over the firstshoulder region and/or the second shoulder region of the vest, such aswith an adhesive. Alternatively, the outer layer of the safety vest caninclude a mesh or perforated material, and the garment insert 410 can besewn into the lining of the safety vest behind the mesh material. Theouter layer can thus function as a smooth protective layer over thegarment insert 410 but can also pass light output by the LEDs, and thelining can function to support the garment insert 410.

In another example, the garment insert 410 is incorporated into afitness or exercise garment in Block S250, as described below. In thisexample, the garment insert 410 can include: a sensing component carrier440 including a rigid biometric sensor (e.g., a heart rate sensor, askin temperature, a skin conductivity sensor, or an arterial oxygensaturation sensor); a control component carrier 440 including a rigidintegrated circuit functioning as a controller; a power componentcarrier 440 including a rechargeable battery; and a wireless componentcarrier 440 including an rigid wireless transmitter integrated circuitand a rigid surface-mount clock. Once the component carriers areinstalled on the fabric substrate 420 over corresponding electrodes ofthe conductive coating 430: the battery component carrier 440 can powerthe controller and the wireless transmitter via corresponding traces onthe fabric substrate 420; the controller can sample the rigid biometricsensor via a connecting trace on the fabric substrate 420; and thewireless transmitter can broadcast packets of biometric data read fromthe biometric sensor through a wireless antenna defined by theconductive coating 430 and fabricated directly on the fabric substrate420.

In yet another example, the garment insert 410 is incorporated into aheated jacket in Block S250. In this example, the garment insert 410 caninclude: a control component carrier 440 including a rigid analogswitch; and a power component carrier 440 including a rechargeablebattery. A set of heating elements can be fabricated directly onto thefabric substrate 420, as described above, between traces defined by theconductive coating 430, and the control and power carriers can beinstalled in corresponding locations on the fabric substrate 420 inBlocks S220 and S240, as described below, to complete the circuit. Thebattery component carrier 440 can thus supply power to the heatingelements via traces fabricated directly on the fabric substrate 420 whenthe rigid analog switch on the control component carrier 440 isactuated.

However, the garment insert 410 can include one or more componentcarriers of any other type or form and can include any other one or moreelectrical components or integrated circuits.

4.4 Conductive Ink

One variation of the second method S200 includes Block S220, whichrecites applying a volume of conductive ink 460 to the first side of thefabric substrate 420 over the electrode 444, the volume of conductiveink 460 configured to conduct electrical current between the electrode444 and the conductive interface pad 446. Generally, in Block S220, avolume of conductive ink 460, such as described above, can be applied tothe fabric substrate 420 over an electrode 444 defined by the conductivecoating 430 before the component carrier 440 is installed on the fabricsubstrate 420 and can function as a conductive buffer that preservescontact between the electrode 444 on the fabric substrate 420 and theconductive interface pad 446 on the component carrier 440 as the garmentinsert 410 is folded, stretched, rolled, twisted, or otherwisemanipulated.

One variation of the garment insert 410 can therefore include a volumeof conductive ink 460 applied over the layer of conductive material 430at the electrode 444, and the component carrier 440 can be arranged overthe fabric substrate 420 with the conductive interface pad 446 incontact with the volume of conductive ink 460 opposite the layer ofconductive material 430. In particular, the volume of conductive ink 460can be interposed between an electrode 444 defined by the conductivecoating 430 and a corresponding conductive interface pad 446 on thecomponent carrier 440 and can conduct electrical current between theelectrode 444 and the conductive interface pad 446. For example, theconductive ink can include a volume of solvent, elastic polymerparticles in solution in the volume of solvent, and conductive metalparticles, as described above. In this example, once the volume ofsolvent has fully volatized (i.e., evaporated), the volume of conductiveink 460 can include conductive metal particles suspended in an elasticpolymer (e.g., latex) matrix.

In one implementation, an ink deposition system 300, as described above,deposits quantities of conductive ink onto the fabric substrate 420 overan electrode 444 defined by the conductive coating 430 in Block S220before aligning the conductive interface pad 446 of the componentcarrier 440 with the electrode 444 on the fabric substrate 420 in BlockS240. In this implementation, the ink deposition system 300 can tensiona weft of the fabric substrate 420 while the conductive ink dries (i.e.,while the solvent volatizes). For example, the ink deposition system 300can: tension a region of the fabric substrate 420 containing theelectrode 444 by 5% against the weft of the fabric substrate 420 (i.e.,to a measured strain of 5% against the weft of the fabric substrate 420)in order to open woven regions of the fabric substrate 420 to acceptconductive ink; deposit a preset volume of conductive ink 460 over theelectrode 444; and release tension on the fabric substrate 420 after acalculated drying time. In this example, the ink deposition system 300can calculate the drying time corresponding to a target estimatedproportion of volatized solvent (e.g., 30%, 90%) based on currentprocessing conditions, such as based on a current barometric pressureand a current ambient temperature. The ink deposition system 300 can seta timer for the calculated drying time once ink is deposited onto thefabric substrate 420 and then rapidly release tension on the fabricsubstrate 420 or slowly release tension on the fabric substrate 420(e.g., at a rate of 0.5% strain per second) once the timer expires. Theconductive ink can thus penetrate the fabric substrate 420 around aregion of the conductive coating 430 defining the electrode 444, and theink deposition system 300 can release tension on the fabric substrate420 before the conductive ink fully dries such that the fabric substrate420 compresses around the drying conductive ink and such that theconductive ink forms around both sides of the fabric substrate 420,thereby mechanically locking the conductive ink onto the fabricsubstrate 420.

Alternatively, the conductive ink can be applied to the fabric substrate420 over the electrode 444 by screen-printing. For example, the fabricsubstrate 420 can be arranged across a porous or perforated tray, thetray can be submerged in a shallow solvent (e.g., acetone) bath,conductive ink can be screen printed onto select regions of the fabricsubstrate 420, and the tray can be elevated out of the solvent path fordrying.

Yet alternatively, the conductive ink can be applied to the componentcarrier 440 over the conductive interface pad 446 in Block S230 prior toplacement of the component carrier 440 onto the fabric substrate 420 inBlock S240 and mechanical fastening of the component carrier 440 to thefabric substrate 420 in Block S250. However, any other quantity ofconductive ink can be applied to the fabric substrate 420 and/or to thecomponent carrier 440 in any other way in Block S230 to create aconductive interface between the conductive coating 430 on the fabricsubstrate 420 and the conductive interface pad 446 on the componentcarrier 440.

Alternatively, conductive ink can be printed on the fabric substrate, asdescribed above, to additively form traces and electrodes on one or bothsides of the fabric substrate. One or more component carriers can thenbe installed over and in electrical contact with traces of electrodes ofconductive ink to complete an electrical on the garment insert 410, asdescribed below.

4.5 Garment Insert+Component Carrier Connection

Block S230 of the second method S200 recites arranging a conductiveinterface pad 446 of a component carrier 440 over an electrode 444defined by remaining conductive material on the fabric substrate 420,wherein the component carrier 440 includes a flexible substrate 442 anda rigid electrical component 444 mounted to the flexible substrate 442,and wherein the conductive interface pad 446 extends from a terminal ofthe rigid electrical component 444 across a region of the flexiblesubstrate 442; and Block S240 of the second method S200 recitesmechanically fastening the component carrier 440 to the fabric substrate420 to form a garment insert 410 including an electrical circuit.Generally, in Blocks S230 and S240, the component carrier 440 isarranged over and mechanically fastened to the fabric substrate 420 withthe conductive interface pad 446 of the component carrier 440electrically coupled to the electrode 444 defined by the conductivecoating 430.

In the variation described above in which conductive ink is applied tothe fabric substrate 420 in Block S230, the component carrier 440 can beplaced in contact with wet (i.e., uncured, not fully volatized)conductive ink such that the conductive ink bonds to the componentcarrier 440 before drying. (Similarly, in the variation described abovein which conductive ink is applied to the component carrier 440 in BlockS230, the component carrier 440 can be placed face down onto acorresponding region of the fabric substrate 420 while the conductiveink is still wet such that the conductive ink bonds to the fabricsubstrate 420 before drying.) For example, while the conductive ink isstill wet, the component carrier 440 can be placed over the conductiveink such as manually by an operator or by a computer-numeric-controlledsurface mount technology component placement system. As the conductiveink dries, the conductive ink can bond to the component carrier 440 toadhere the component carrier 440 to the fabric substrate 420. Theconductive ink can thus preserve the location of the component carrier440 on the fabric substrate 420 while the component carrier 440 ismechanically fastened to the fabric substrate 420 in Block S240.

In one implementation, Block S240 includes sewing a filament 450 (e.g.,thread) through the fabric substrate 420 and the component carrier 440.In one example, the component carrier 440 is pierced by a needle and athread simultaneously stitched through the component carrier 440 and thefabric substrate 420, such as with a running or overcast stitch, tofasten the component carrier 440 to the fabric substrate 420 in BlockS240, as shown in FIG. 10A. For example, the component carrier 440 canbe stitched onto the fabric substrate 420 with anelectrically-insulative (e.g., non-conductive) thread, such as of cottonor wool. Alternatively, the component carrier 440 can be stitched ontothe fabric substrate 420 with an electrically-conductive wire, such ascopper or silver wire.

The component carrier 440 can alternatively be pierced or perforatedseparately and before installation on the fabric substrate 420 to accepta stitch. For example, the component carrier 440 can be fabricated withan array of vias, such as patterned along a perimeter of the flexiblesubstrate 442 or around the perimeter of the conductive interface pad446, and electrically-insulative thread can be passed through these viasand through the fabric substrate 420 to fasten the component carrier 440to the fabric substrate 420 in Block S230, as shown in FIG. 9.

The component carrier 440 can be fastened to the fabric substrate 420with a stitch running along the perimeter of the component carrier 440.In one example in which the component carrier 440 defines a circularsection, the component carrier 440 can be stitched fully about itsperimeter to the fabric substrate 420 in Block S240. In another examplein which the component carrier 440 defines a rectangular section, thecomponent carrier 440 can be stitched along its two long, opposing sidesto the fabric substrate 420 in Block S240. Alternatively, in Block S240,a stitch can be passed through the conductive interface pad 446 and thecorresponding electrode 444 on the fabric substrate 420 to mechanicallyconstrain the conductive interface pad 446 onto the electrode 444

In the variation described above in which conductive ink is appliedbetween the conductive interface pad 446 and an electrode 444 on thefabric substrate 420, thread can be stitched through the componentcarrier 440 and the fabric substrate 420 about a perimeter of theconductive interface pad 446 in Block S240 to compress conductive inkbetween the perimeter of the conductive interface pad 446 and theelectrode 444. Similarly, a stitch can pierce the component carrier 440at the conductive interface pad 446 and pass through the conductive inkand through the electrode 444 on the fabric substrate 420 tomechanically bind the conductive ink between the conductive interfacepad 446 and the electrode 444.

In another implementation, the component carrier 440 can be mechanicallyfastened to the fabric substrate 420 with a clothing button stitched tothe fabric substrate 420 and passed through the component carrier 440(or vice versa). For example, the flexible substrate 442 of thecomponent carrier 440 can define a slit intersecting the conductiveinterface pad 446 and configured to receive a button stitched to thefabric substrate 420 over the electrode 444. In yet anotherimplementation, the component carrier 440 can be riveted to the fabricsubstrate 420, such as through the conductive interface pad 446, theelectrode 444, and through a second component carrier on the oppositeside of the fabric substrate, as shown in FIG. 10B. However, thecomponent carrier 440 can be aligned with and mechanically fastened tothe fabric substrate 420 in any other way in Blocks S230 and S240.

4.6 Hydrophobic Coating

As shown in FIGS. 9 and 10B, one variation of the second method S200includes Block S260, which recites applying a non-conductive hydrophobiccoating 470 across the first side of the fabric substrate 420, thesecond side of the fabric substrate 420, and a side of the componentcarrier 440 opposite the fabric substrate 420. Generally, in Block S260,a flexible hydrophobic coating 470 can be applied across both sides ofthe fabric substrate 420 to encase the conductive coating 430. Thehydrophobic coating 470 can also be applied across the component carrier440, such as across a back side of the component carrier 440 oppositethe fabric substrate 420 and across a junction between the first side ofthe fabric substrate 420 and the back side of the component carrier 440to (substantially) fully seal the electronic circuit against moistureingress.

The garment insert 410 can therefore include a hydrophobic coating 470applied across the first side of the fabric substrate 420, across asecond side of the fabric substrate 420 opposite the first side, andacross the layer of conductive material 430. In one implementation, oncethe conductive coating 430 is selectively etched from the fabricsubstrate 420 in Block S214, a third mask is applied to the first sideof the fabric substrate 420 to cover electrodes defined by theconductive coating 430, such as according to methods and techniquesdescribed above. A hydrophobic material—such as manganese oxidepolystyrene, zinc oxide polystyrene, or precipitated calciumcarbonate—can then be sprayed or rolled onto the first and second sidesof the fabric substrate 420; the fabric substrate 420 can be dipped in abath of hydrophobic material, removed from the bath, and dried; or thehydrophobic material can be applied to the first and second sides of thefabric substrate 420 in any other way. Once the hydrophobic material isapplied to and cured on the fabric substrate 420, the third mask can beremoved from the first side of the fabric substrate 420, such asdescribed above.

In the variation described above in which a first conductive coating 430defining traces of a first circuit is applied to the first side of thefabric substrate 420 and in which a second conductive coating 431defining traces of a second circuit is applied to the second side of thefabric substrate 420, electrodes defined by the first and secondconductive coatings can be similarly masked prior to application of thehydrophobic coating 470 onto the first and second sides of the fabricsubstrate 420, and the mask(s) can be removed from the fabric substrate420 to expose these electrodes prior to installation of one or morecomponent carriers onto the fabric substrate 420. The first and secondsides of the fabric substrate 420 can thus be coated with hydrophobicmaterial—except over electrodes subsequently connected to conductiveinterface pads of corresponding component carriers—in Block S260.

In the foregoing implementation, when the conductive interface pad 446of the component carrier 440 is placed over a corresponding electrode444 on the fabric substrate 420, the perimeter of the component carrier440 can extend over a region of the fabric substrate 420 coated with thehydrophobic material. Prior to arrangement on the fabric substrate 420in Block S230, a flexible sealant, such as silicone or urethane, can beapplied around the perimeter of the component carrier 440 and can bondto both the flexible substrate 442 of the component carrier 440 and tothe hydrophobic coating 470 on the fabric substrate 420 to seal theelectronic component—mounted to the component carrier 440—between theflexible substrate 442 and the fabric substrate 420. (Alternatively, theflexible sealant can be applied to fabric substrate 420 over thehydrophobic coating 470 and can bond to the flexible substrate 442 ofthe component carrier 440 when the component carrier 440 is installedthereover in Block S230.) Alternatively, the flexible sealant can beapplied to the garment insert 410 around the perimeter of the componentcarrier 440 once the component carrier 440 is installed on the fabricsubstrate 420 in Block S240.

In another implementation, the garment insert 410 is coated withhydrophobic coating 470 following assembly of the fabric substrate 420and the component carrier 440. In this implementation, the garmentinsert 410—including the fabric substrate 420, conductive coating 430,and component carrier 440—can be sprayed with or submersed inhydrophobic material in order to coat exposed regions of the fabricsubstrate 420, exposed regions of the conductive coating 430, and theback side of the component carrier 440 with hydrophobic material. Inthis implementation, prior to coating with hydrophobic material, aflexible sealant can be applied between the component carrier 440 andthe fabric substrate 420, over the fabric substrate 420 around anelectrode 444, or around a perimeter of the component carrier 440adjacent the conductive interface pad 446, as described above, in orderto bridge the component carrier 440 and the fabric substrate 420. Thehydrophobic coating 470 can thus be applied across exposed regions ofthe fabric substrate 420, exposed regions of the conductive coating 430,the back side of the component carrier 440, and exposed surfaces of theflexible coating in Block S260 in order to fully seal the electroniccircuit defined by the conductive coating 430 and the component carrier440 from moisture ingress.

In this variation, elements of the garment insert 410 can be similarlycoated with an oleophobic material or other material or sealant toimprove durability of the electronic circuit in the presence of water,oil, dirt, and other contaminants. However, such coatings can be appliedto the garment insert 410 in any other way in Block S260.

4.7 Garment

Block S250 of the second method S200 recites incorporating the garmentinsert 410 into the garment. Generally, in Block S250, the garmentinsert 410 can be stitched into or applied onto a garment in order toincorporate electronic or digital functions into the garment.

In one implementation, the garment includes an outer layer of a textilematerial and a lining, also of a textile material. In thisimplementation, the garment layer can be installed between the outerlayer and the lining, such as by sewing the garment insert 410 betweenthe outer layer and the lining of the garment with anelectrically-insulative (e.g., cotton-based) thread. The outer layer canthus function to conceal the garment insert 410, and the lining canfunction to buffer the garment insert 410 from a user's (i.e., awearer's) skin.

Similarly, the garment can include a single aesthetic textile layer, andthe garment insert 410 can be sewn over or under the aesthetic textilelayer. For example, the garment insert 410 can be installed onto theaesthetic textile layer with the first side of the garment insert 410facing the aesthetic textile layer, and an aesthetic coating (e.g., afabric paint) can be applied across the second side of the fabricsubstrate 420 of the garment insert 410—facing outwardly from theaesthetic textile layer—to aesthetically align the garment insert 410with the aesthetic textile layer. Alternatively, the garment insert 410can be installed (e.g., sewn) under the aesthetic textile layer with thefirst side of the garment insert 410 facing the aesthetic textile layer,and the second side of the fabric substrate 420—which may be free ofcomponent carriers—can face and contact the user's skin. In thisexample: the garment insert 410 can include a biometric componentcarrier 440 arranged on the first side of the fabric substrate 420 andincluding a biometric sensor electrically coupled to a first electrode444 defined by a first layer of conductive material 430 on the firstside of the fabric substrate 420; the first electrode 444 can beelectrically coupled to a second electrode defined by a second layer ofconductive material 430 on the second side of the fabric substrate 420,such as by conductive thread or a metallic button passing through thefabric substrate 420 to form a via, as described above; the secondelectrode can contact the user's skin when the garment is worn, and thebiometrics sensor can read a biometric signal from the user's skin viathe second electrode.

In this implementation, the garment insert 410 can similarly be rivetedonto, glued onto, buttoned into, or otherwise installed on or within thegarment.

In another implementation, the garment insert 410 is ironed onto thegarment in Block S250. In this implementation, the garment insert 410can include a heat-activated fabric adhesive 480 applied across thefirst side of the fabric substrate 420 (and across the back side of thecomponent carrier 440 opposite the fabric substrate 420), as shown inFIGS. 9 and 10B. The garment insert 410 can thus be arranged over theoutside of the garment (e.g., on the outer layer) or on the inside ofthe garment (e.g., on the lining of the garment), and a clothes iron orother heated surface can then be applied over the second side of thefabric substrate 420 to activate the fabric adhesive, thereby adheringthe garment insert 410 to the garment.

In the foregoing implementation, the garment insert 410 can furtherinclude a flexible heat shield 482 configured to shield the electricalcomponent 444—mounted to the component carrier 440—from excess heatwhile the garment insert 410 is ironed onto the garment, as shown inFIGS. 9 and 10B. For example, the heat shield 482 can include a secondsheet of aramid fibers, such as in the form of a flexible PCB, stitchedor adhered over the second side of the fabric substrate 420 opposite thecomponent carrier 440. In this example, the heat shield 482 can span thefull height and width of the component carrier 440 or can span a smallersubregion of the component carrier 440 containing the electricalcomponent 444. In a similar example, the heat shield 482 can beinterposed between the component carrier 440 and the fabric substrate420. Alternatively, the electrical component 444 can be encased inpotting material on the component carrier 440, and the potting materialcan form a heat shield 482 to protect the electrical component 444during excess heat. However, the garment insert 410 can include a heatshield 482 of any other material or form in order to protect theelectrical component 444 from excess heat, which may damage theelectrical component 444, when the garment insert 410 is ironed onto thegarment. (In variations in which the garment insert 410 is stitched ontoor into the garment, the garment insert 410 can similarly include a heatshield 482 arranged over the electrical component 444 and configured toshield the electrical component 444 from excess heat when the garment isironed during laundering.)

In the variation in which the garment insert 410 includes a volume ofconductive ink 460 interposed between the component carrier 440 and thefabric substrate 420, the conductive ink can be cured by heat output bythe clothing iron when the garment insert 410 is ironed onto thegarment. For example, heat from the clothes iron can evaporate solventremaining in the conductive ink as the garment insert 410 is ironed ontothe garment. Similarly, heat output by the clothes iron can sinter metalparticles in the conductive ink, thereby forming a continuous conductivepath between the electrode 444 on the fabric substrate 420 and theconductive interface pad 446 on the component carrier 440. For example,the conductive ink can include silver-alloy or copper-alloy particles ofsizes sufficiently small to rapidly approach a glass or meltingtemperature when a heated clothes iron is moved across the garmentinsert 410 such that a portion of the silver-alloy or copper-alloyparticles fuse.

Alternatively, the garment insert 410 can define a bond-ready “patch”supplied to a customer or to a user with heat-activated fabric adhesive480 applied over one or both sides. Upon receipt of the garment insert410, a customer may iron the garment insert 410 onto an existinggarment, thereby integrating a “smart textile” circuit into the garmentin a single step. Similarly, upon receipt of the garment insert 410, thecustomer may sew the garment insert 410 into the existing garment.However, the garment insert 410 can be incorporated or prepared forintegration into a garment in any other way.

The systems and methods described herein can be embodied and/orimplemented at least in part as a machine configured to receive acomputer-readable medium storing computer-readable instructions. Theinstructions can be executed by computer-executable componentsintegrated with the application, applet, host, server, network, website,communication service, communication interface,hardware/firmware/software elements of a user computer or mobile device,wristband, smartphone, or any suitable combination thereof. Othersystems and methods of the embodiment can be embodied and/or implementedat least in part as a machine configured to receive a computer-readablemedium storing computer-readable instructions. The instructions can beexecuted by computer-executable components integrated bycomputer-executable components integrated with apparatuses and networksof the type described above. The computer-readable medium can be storedon any suitable computer readable media such as RAMs, ROMs, flashmemory, EEPROMs, optical devices (CD or DVD), hard drives, floppydrives, or any suitable device. The computer-executable component can bea processor but any suitable dedicated hardware device can(alternatively or additionally) execute the instructions.

As a person skilled in the art will recognize from the previous detaileddescription and from the figures and claims, modifications and changescan be made to the embodiments of the invention without departing fromthe scope of this invention as defined in the following claims.

We claim:
 1. A method for fabricating a soft good product comprising:applying a first mask to a first side of a fabric substrate coated witha conductive material, wherein, after the first mask is applied, a firstportion of the first side of the fabric substrate is covered by thefirst mask and a second portion of the first side of the fabricsubstrate is not covered by the first mask; applying a second mask to asecond side of the fabric substrate opposite the first side, wherein,after the second mask is applied, a first portion of the second side ofthe fabric substrate is covered by the second mask and a second portionof the second side of the fabric substrate is not covered by the secondmask, wherein the first portion of the first side of the fabricsubstrate is opposite the first portion of the second side of the fabricsubstrate, and wherein the second portion of the first side of thefabric substrate is opposite the second portion of the second side ofthe fabric substrate; applying a chemical to the fabric substrate toremove conductive material outside of the first mask; after applying thechemical, fastening a component carrier to the first side of the fabricsubstrate, wherein the component carrier comprises: a flexiblesubstrate, a rigid electrical component having a terminal, wherein therigid electrical component is mounted to the flexible substrate, and aconductive interface pad extending from the terminal across a region ofthe flexible substrate; creating a circuitry layer by assembling andforming an electrical connection between the conductive interface padand an electrode formed of conductive material on the first side of thefabric substrate; and incorporating the circuitry layer into a softgood.
 2. The method of claim 1, further comprising applying anon-conductive hydrophobic coating across the first side of the fabricsubstrate, the second side of the fabric substrate, and a side of thecomponent carrier opposite the fabric substrate.
 3. The method of claim1, wherein creating the circuitry layer includes applying a volume of asubstance comprising a conductive particulate, a polymer, and a solventto the first side of the fabric substrate over the electrode, the volumeof the substance configured to conduct electrical current between theelectrode and the conductive interface pad.
 4. The method of claim 3,wherein applying the volume of a substance comprising a conductiveparticulate, a polymer, and a solvent to the first side of the fabricsubstrate comprises tensioning a weft of the fabric substrate while aportion of a volume of the solvent volatizes.
 5. The method of claim 3,wherein creating the circuitry layer comprises stitching anelectrically-insulative filament through the fabric substrate and thecomponent carrier proximal a perimeter of the volume of the substance.6. The method of claim 3, wherein applying the volume of the substanceto the first side of the fabric substrate comprises screen-printing thevolume of the substance onto the first side of the fabric substrate. 7.The method of claim 1, wherein incorporating the circuitry layer intothe soft good comprises: applying a heat-activated fabric adhesiveacross the first side of the fabric substrate; arranging the circuitrylayer a region of a soft good; and applying a heated surface to thesecond side of the fabric substrate to activate the heat-activatedfabric adhesive and to adhere the circuitry layer to the soft good. 8.The method of claim 1, wherein incorporating the circuitry layer intothe soft good comprises sewing the circuitry layer between an outerlayer and a lining of the soft good with an electrically-insulativethread.
 9. A soft good product comprising: an outer layer comprising atextile; a lining comprising a textile; a circuitry layer interposedbetween the outer layer and the lining and comprising: a fabricsubstrate having a first side and a second side, wherein the first sideof the fabric substrate includes traces of an electrical circuit,wherein the traces are formed by: applying a first mask to the firstside of the fabric substrate coated with a conductive material, wherein,after the first mask is applied, a first portion of the first side ofthe fabric substrate is covered by the first mask and a second portionof the first side of the fabric substrate is not covered by the firstmask; applying a second mask to the second side of the fabric substrateopposite the first side of the fabric substrate, wherein, after thesecond mask is applied, a first portion of the second side of the fabricsubstrate is covered by the second mask and a second portion of thesecond side of the fabric substrate is not covered by the second mask,wherein the first portion of the first side of the fabric substrate isopposite the first portion of the second side of the fabric substrate,and wherein the second portion of the first side of the fabric substrateis opposite the second portion of the second side of the fabricsubstrate; and applying a chemical to the fabric substrate to removeconductive material outside of the first mask; and a component carriercomprising: a flexible substrate, a rigid electrical component mountedto the flexible substrate, and a first conductive interface padextending from a first terminal of the rigid electrical component;wherein the first conductive interface pad is electrically coupled to atleast one of the traces.
 10. The soft good product of claim 9: whereinthe fabric substrate comprises a section of textile; wherein the sectionof textile includes the traces of the electrical circuit on the firstside of the section of textile; and wherein the flexible substratecomprises a flexible plastic material.
 11. The soft good product ofclaim 10: wherein the outer layer and the lining cooperate to define atextile product; and wherein the circuitry layer defines a patchextending across a region of the textile product and is sewn into thelining.
 12. The soft good product of claim 9: wherein the rigidelectrical component comprises an element of a biometric sensor; andwherein the traces define a wireless antenna configured to broadcast awireless signal representative of biometric data read by the biometricsensor.
 13. The soft good product of claim 9: wherein the traces includea first electrode; and further comprising a filament passing through thefabric substrate and the component carrier and configured to constrainthe component carrier over the fabric substrate with the firstconductive interface pad arranged over the first electrode.
 14. The softgood product of claim 13, further comprising a volume of a substancecomprising a conductive particulate, a polymer, and a solvent interposedbetween the first electrode and the first conductive interface pad,wherein the volume of the substance is configured to conduct electricalcurrent between the first electrode and the first conductive interfacepad.
 15. The soft good product of claim 14, wherein the filamentcomprises an electrically-insulative thread sewn through the componentcarrier and the fabric substrate about a perimeter of the volume of thesubstance.
 16. The soft good product of claim 9, further comprising ahydrophobic coating applied across the first side of the fabricsubstrate, the second side of the fabric substrate opposite the firstside, and a side of the component carrier opposite the fabric substrate.17. A circuitry layer configured to be sewn into a soft good product,the circuitry layer comprising: a fabric substrate having a first sideand a second side, wherein the first side of the fabric substrateincludes traces of an electrical circuit, wherein the traces include atleast one electrode, wherein the traces are formed by: applying a firstmask to the first side of a fabric substrate coated with a conductivematerial, wherein, after the first mask is applied, a first portion ofthe first side of the fabric substrate is covered by the first mask anda second portion of the first side of the fabric substrate is notcovered by the first mask; applying a second mask to a second side ofthe fabric substrate opposite the first side of the fabric substrate,wherein, after the second mask is applied, a first portion of the secondside of the fabric substrate is covered by the second mask and a secondportion of the second side of the fabric substrate is not covered by thesecond mask, wherein the first portion of the first side of the fabricsubstrate is opposite the first portion of the second side of the fabricsubstrate, and wherein the second portion of the first side of thefabric substrate is opposite the second portion of the second side ofthe fabric substrate; and applying a chemical to the fabric substrate toremove conductive material outside of the first mask; a volume of asubstance comprising a conductive particulate, a polymer, and a solventapplied over the electrode; a component carrier comprising: a flexiblesubstrate, an electrical component mounted to the flexible substrate,and a conductive interface pad arranged on the substrate and extendingfrom a terminal of the electrical component; wherein the conductiveinterface pad is in contact with the volume of the substance; and afilament passing through the fabric substrate and the component carrierand configured to constrain the fabric substrate and the componentcarrier against the volume of the substance.
 18. The circuitry layer ofclaim 17, further comprising a heat-activated fabric adhesive appliedacross the first side of the fabric substrate.
 19. The circuitry layerof claim 18, further comprising a heat shield sewn onto the fabricsubstrate opposite the electrical component.
 20. The circuitry layer ofclaim 17: wherein the filament comprises an electrically-insulativethread stitched through the fabric substrate and the component carrieradjacent the volume of the substance.